Microstructure analysis of the interface situation and adhesion of thermally formed nickel silicide for plated nickel-copper contacts on silicon solar cells

Solar Energy Materials and Solar Cells

Volumn 117, Issue , 2013, Pages 209-213

  Mondon, A ^a   Jawaid, M N ^a   Bartsch, J ^a   Glatthaar, M ^a   Glunz, S W ^a  

^a FRAUNHOFER INSTITUTE FOR SOLAR ENERGY SYSTEMS ISE   (Germany)

Author keywords

Adhesion; Copper; Metallization; Nickel; Plating; Silicide formation

Indexed keywords

ADHESION PROMOTION; METAL-SILICON INTERFACES; MICROSTRUCTURAL ANALYSIS; MICROSTRUCTURE ANALYSIS; NICKEL SILICIDE; SILICIDE FORMATION; THERMAL FORMATION; THERMAL-ANNEALING;

ADHESION; COPPER; METAL ANALYSIS; METALLIZING; NICKEL; PLATING; SILICIDES; SILICON; SILICON WAFERS; SINTERING;

SILICON SOLAR CELLS;

EID: 84879623347     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2013.06.005     Document Type: Article

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