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Volumn 21, Issue , 2012, Pages 39-46

Electroless nickel deposition and silicide formation for advanced front side metallization of industrial silicon solar cells

Author keywords

Electroless plating; Metallization; Nickel silicides; Solar cells

Indexed keywords


EID: 84897104540     PISSN: 18766102     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1016/j.egypro.2012.05.006     Document Type: Conference Paper
Times cited : (37)

References (14)
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    • Valencia, Spain
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    • (2010) Proc. of the 25th EUPVSEC
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  • 6
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    • Advances in electroless nickel plating for the metallization of silicon solar cells using different structuring techniques for the ARC
    • Alemán M, Bay N, Barucha D, Knorz A, Biro D, Preu R, and Glunz SW. Advances in electroless nickel plating for the metallization of silicon solar cells using different structuring techniques for the ARC, Proc. of the 24th EUPVSEC, Hamburg, Germany, 2009, 2009, Vol. 165, p. 53-56.
    • (2009) Proc. of the 24th EUPVSEC, Hamburg, Germany, 2009 , vol.165 , pp. 53-56
    • Alemán, M.1    Bay, N.2    Barucha, D.3    Knorz, A.4    Biro, D.5    Preu, R.6    Glunz, S.W.7
  • 7
    • 77952419244 scopus 로고    scopus 로고
    • Electrochemical methods to analyse the light-induced plating process
    • Bartsch J, Radtke V, Schetter C, and Glunz SW. Electrochemical methods to analyse the light-induced plating process, J. Appl. Electrochem., 2010, Vol. 40, p.757-765.
    • (2010) J. Appl. Electrochem , vol.40 , pp. 757-765
    • Bartsch, J.1    Radtke, V.2    Schetter, C.3    Glunz, S.W.4
  • 9
    • 0032669507 scopus 로고    scopus 로고
    • Mechanism of the chemical deposition of nickel on silicon wafers in aqueous solution
    • Takano N, Hosoda N, Yamada T, and Osaka T. Mechanism of the Chemical Deposition of Nickel on Silicon Wafers in Aqueous Solution, Journal of The Electrochemical Society, 1999, Vol. 146 (4), p 1407-1411.
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    • Takano, N.1    Hosoda, N.2    Yamada, T.3    Osaka, T.4
  • 10
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    • Mechanism of immersion deposition of Ni-P films on Si(100) in an aqueous alkaline solution containing sodium hypophosphite
    • Hsu HF, Tsai CL, Lee CW, and Wu H.Y. Mechanism of immersion deposition of Ni-P films on Si(100) in an aqueous alkaline solution containing sodium hypophosphite, Thin Solid Films, 2009, Vol. 517, p. 4786-4791.
    • (2009) Thin Solid Films , vol.517 , pp. 4786-4791
    • Hsu, H.F.1    Tsai, C.L.2    Lee, C.W.3    Wu, H.Y.4
  • 13
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    • NISI contact metallization using electroless ni deposition on pd-activated self-assembled monolayer (SAM) on p-type Si(100)
    • Duhin A, Sverdlov Y, Torchinsky I, Feldman Y, and Shacham-Diamand Y. NiSi contact metallization using electroless Ni deposition on Pd-activated self-assembled monolayer (SAM) on p-type Si(100), Microelectronic Engineering, 2007, Vol. 84, p. 2506-2510.
    • (2007) Microelectronic Engineering , vol.84 , pp. 2506-2510
    • Duhin, A.1    Sverdlov, Y.2    Torchinsky, I.3    Feldman, Y.4    Shacham-Diamand, Y.5


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.