Copper as conducting layer in advanced front side metallization processes for crystalline silicon solar cells, exceeding 20% on printed seed layers

Conference Record of the IEEE Photovoltaic Specialists Conference

Volumn , Issue , 2010, Pages 1299-1303

  Bartsch, J ^a   Mondon, A ^a   Schetter, C ^a   Horteis M ^a   Glunz, S W ^a  

^a FRAUNHOFER INSTITUTE FOR SOLAR ENERGY SYSTEMS ISE   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ACCELERATED AGEING; CELL EFFICIENCY; CELL LIFE; CONDUCTING LAYERS; COPPER DIFFUSION; CRITICAL FACTORS; CRYSTALLINE SILICON SOLAR CELLS; ELECTROLESS PROCESS; HIGH EFFICIENCY; LONG TERM STABILITY; METAL STACK SYSTEM; METALLIZATION PROCESS; METALLIZATIONS; PLATING PROCESS; SEED LAYER; SILVER METALLIZATION; STACK SYSTEMS;

COPPER PLATING; METALLIZING; PHOTOVOLTAIC EFFECTS; SILICON SOLAR CELLS; SOLAR CELLS;

COPPER;

EID: 78650163561     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PVSC.2010.5614244     Document Type: Conference Paper

References (8)

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