Analysis of front metal contact for plated Ni/Cu silicon solar cell

Electronic Materials Letters

Volumn 7, Issue 4, 2011, Pages 349-352

  Lee, Jae Doo ^a   Kwon, Hyuk Yong ^a   Lee, Soo Hong ^a  

^a Sejong University   (South Korea)

Author keywords

Ni silicide; Plating; Scanning Electron microscopy(SEM); Silicon solar cells

Indexed keywords

CU DIFFUSION; ENERGY DISPERSIVE X RAY SPECTROSCOPY; LOW CONDUCTIVITY; MASS PRODUCTION; METAL CONTACTS; NI SILICIDE; PRODUCTION TECHNIQUES; SCANNING ELECTRONS; SCREEN-PRINTED; SCREEN-PRINTED SOLAR CELLS; SINTERING PROCESS;

CONTACT RESISTANCE; ELECTROLESS PLATING; PLATING; SCANNING ELECTRON MICROSCOPY; SILICIDES; SILICON SOLAR CELLS; SINTERING; X RAY SPECTROSCOPY;

NICKEL COMPOUNDS;

EID: 84862929284     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-011-0250-4     Document Type: Article

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