Improved contact formation for large area solar cells using the alternative seed layer (ASL) process

Conference Record of the IEEE Photovoltaic Specialists Conference

Volumn , Issue , 2012, Pages 2208-2212

  Michaelson, Lynne ^a   Munoz, Krystal ^a   Wang, Jonathan C ^a   Xi, Y A ^b   Tyson, Tom ^a   Gallegos, Anthony ^a  

^a YesTech Inc   (United States)

^b Despatch Industries   (United States)

Author keywords

annealing; contact; copper; electrochemical processes; metallization; nickel; silicon

Indexed keywords

CONTACT FORMATION; DIRECT CONTACT; ELECTROCHEMICAL PROCESS; GRID PATTERN; INDUSTRIAL SOLAR CELLS; LARGE-AREA SOLAR CELLS; NI PLATING; NICKEL SILICIDE; POLYCRYSTALLINE SILICON (POLY-SI); PROCESS FLOWS; SEED LAYER; SERIES RESISTANCES; SILICON SURFACES;

ANNEALING; CONTACTS (FLUID MECHANICS); COPPER; ELECTRIC RESISTANCE; METALLIZING; MONOCRYSTALLINE SILICON; POLYSILICON; SILICIDES; SILICON; SOLAR CELLS; TIN; TIN NICKEL PLATING;

NICKEL;

EID: 84869386903     PISSN: 01608371     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/PVSC.2012.6318035     Document Type: Conference Paper

References (5)

1. th EPVSEC, 2010, pp. 2672-2675.
2. th PVSC, Seattle, USA, 2011
3. rd Workshop on Metallization for Crystalline Silicon Solar Cells, Charleroi, Belgium, 2011
4. th EPVSEC, 2009, pp. 1414-1418
5. Technic Inc., http://www.technic.com