Dynamic plastic behavior of 63 wt% Sn 37 wt% Pb eutectic solder under high strain rates

Journal of Materials Science Letters

Volumn 21, Issue 9, 2002, Pages 697-698

  Wang, B ^a   Yi, S ^b  

^a BRUNEL UNIVERSITY   (United Kingdom)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

ASPECT RATIO; COMPOSITION; COMPRESSIVE STRESS; EUTECTICS; PLASTICITY; STRAIN RATE; STRESS ANALYSIS;

COMPRESSIVE LOADING; EUTECTIC SOLDER; IMPACT VELOCITY; SPLIT COMPRESSIVE HOPKINSON PRESSURE BAR SYSTEM;

SOLDERING ALLOYS;

EID: 0036578036     PISSN: 02618028     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1015776820115     Document Type: Article

References (5)

1. Computational continuum modelling of solder interconnect