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Journal of Electronic Materials

Volumn 30, Issue 9, 2001, Pages 1206-1213

Application of an asymmetrical four point bend shear test to solder joints

(6) Unal O a Anderson, I E a Harringa, J L a Terpstra, R L a Cook, B A a Foley, J C a

a IOWA STATE UNIVERSITY (United States)

Author keywords

Deformation; Joint; Shear; Solder; Solder joint; Testing

Indexed keywords

CREEP; DEFORMATION; FINITE ELEMENT METHOD; MECHANICAL TESTING; SHEAR STRENGTH; STRESS ANALYSIS; STRESS CONCENTRATION; STRESS RELAXATION; TIN ALLOYS;

CREEP RESISTANCE; FOUR-POINT BEND SHEAR TEST METHOD;

SOLDERED JOINTS;

EID: 0035455224 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-001-0151-7 Document Type: Article

Times cited : (17)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.