-
1
-
-
85051450492
-
Silicon carbide technology
-
2nd edn., W.-K. Chen, Ed. Boca Raton, FL: CRC Press
-
P. G. Neudeck, "Silicon carbide technology," The VLSI Handbook, 2nd edn., W.-K. Chen, Ed. Boca Raton, FL: CRC Press, 2007, pp. 5.1-5.34.
-
(2007)
The VLSI Handbook
-
-
Neudeck, P.G.1
-
2
-
-
84894336916
-
Impact of SiC power electronic devices for hybrid electric vehicles
-
SAE paper number 2002-01-1904
-
L. M. Tolbert, B. Ozpineci, S. K. Islam, and F.Z. Peng, "Impact of SiC power electronic devices for hybrid electric vehicles," in Proc. Future Car Congress, Arlington, Virginia, Jun. 3-5, 2002 (SAE paper number 2002-01-1904).
-
Proc. Future Car Congress, Arlington, Virginia, Jun. 3-5, 2002
-
-
Tolbert, L.M.1
Ozpineci, B.2
Islam, S.K.3
Peng, F.Z.4
-
3
-
-
76649133450
-
SiC wirebond multichip phase-leg module packaging design and testing for harsh environment
-
Jan.
-
P. Ning, R. Lai, D. Huff, F. Wang, K. D. T. Ngo, V. D. Immanuel, and K. J. Karimi, "SiC wirebond multichip phase-leg module packaging design and testing for harsh environment," IEEE Trans. Power Electron., vol. 25, no. 1, pp. 16-23, Jan. 2010.
-
(2010)
IEEE Trans. Power Electron.
, vol.25
, Issue.1
, pp. 16-23
-
-
Ning, P.1
Lai, R.2
Huff, D.3
Wang, F.4
Ngo, K.D.T.5
Immanuel, V.D.6
Karimi, K.J.7
-
4
-
-
77956547372
-
High power SiC modules for HEVs and PHEVs
-
M. Chinthavali, L. M. Tolbert, H. Zhang, J. H. Han, F. Barlow, and B. Ozpineci, "High power SiC modules for HEVs and PHEVs," in Proc. Int. Power Electron. Conf., Jun. 21-24, 2010, pp. 1842-1848.
-
Proc. Int. Power Electron. Conf., Jun. 21-24, 2010
, pp. 1842-1848
-
-
Chinthavali, M.1
Tolbert, L.M.2
Zhang, H.3
Han, J.H.4
Barlow, F.5
Ozpineci, B.6
-
5
-
-
63149155798
-
High-temperature all-SiC bidirectional DC/DC converter for plug-in-hybrid vehicle (PHEV)
-
S. K. Mazumder, K. Acharya, and P. Jedraszczak, "High-temperature all-SiC bidirectional DC/DC converter for plug-in-hybrid vehicle (PHEV)," in Proc. 34th Annu. Conf. IEEE Ind. Electron., Nov. 10-13, 2008, pp. 2873-2878.
-
Proc. 34th Annu. Conf. IEEE Ind. Electron., Nov. 10-13, 2008
, pp. 2873-2878
-
-
Mazumder, S.K.1
Acharya, K.2
Jedraszczak, P.3
-
6
-
-
80053180055
-
Evaluation of a 1200-V, 800-AAll-SiC Dual Module
-
Sep.
-
R. A. Wood and T. E. Salem, "Evaluation of a 1200-V, 800-AAll-SiC Dual Module," IEEE Trans. Power Electron., vol. 26, no. 9, pp. 2504-2511, Sep. 2011.
-
(2011)
IEEE Trans. Power Electron.
, vol.26
, Issue.9
, pp. 2504-2511
-
-
Wood, R.A.1
Salem, T.E.2
-
7
-
-
65949090523
-
Efficient, high-temperature bidirectional DC/DC converter for plug-in-hybrid electric vehicle (PHEV) using SiC devices
-
K. Acharya, S. K. Mazumder, and P. Jedraszczak, "Efficient, high-temperature bidirectional DC/DC converter for plug-in-hybrid electric vehicle (PHEV) using SiC devices," in Proc. 24th Annu. IEEE Appl. Power Electron. Conf. Expo., Feb. 15-19, 2009, pp. 642-648.
-
Proc. 24th Annu. IEEE Appl. Power Electron. Conf. Expo., Feb. 15-19, 2009
, pp. 642-648
-
-
Acharya, K.1
Mazumder, S.K.2
Jedraszczak, P.3
-
8
-
-
79951660110
-
Photonic compensation of temperature-induced drift of SiC-DMOSFET switching dynamics
-
Nov.
-
T. Sarkar and S. K. Mazumder, "Photonic compensation of temperature-induced drift of SiC-DMOSFET switching dynamics," IEEE Trans. Power Electron., vol. 25, no. 11, pp. 2704-2709, Nov. 2010.
-
(2010)
IEEE Trans. Power Electron.
, vol.25
, Issue.11
, pp. 2704-2709
-
-
Sarkar, T.1
Mazumder, S.K.2
-
9
-
-
84876905854
-
High-temperature SiC packaging for HEV traction applications
-
K. Vanam, F. Barlow, B. Ozpineci, L. D. Marlino, M. S. Chinthavali, L. M. Tolbert, and A. Elshabini, "High-temperature SiC packaging for HEV traction applications," in Proc. IMAPS Int. Symp. Microelectron. 2007, Nov. 11-15, 2007, San Jose, CA, p. 6.
-
Proc. IMAPS Int. Symp. Microelectron. 2007, Nov. 11-15, 2007, San Jose, CA
, pp. 6
-
-
Vanam, K.1
Barlow, F.2
Ozpineci, B.3
Marlino, L.D.4
Chinthavali, M.S.5
Tolbert, L.M.6
Elshabini, A.7
-
10
-
-
33749506452
-
High-temperature, high-density packaging of a 60 kW converter for > 200°C embedded operation
-
D. C. Hopkins, D. W. Kellerman, R. A. Wunderlich, C. Basaran, and C. J. Gomez, "High-temperature, high-density packaging of a 60 kW converter for > 200°C embedded operation," in Proc. 21st Annu. IEEE Appl. Power Electron. Conf. Expo., Mar. 19-23, 2006, pp. 871-877.
-
Proc. 21st Annu. IEEE Appl. Power Electron. Conf. Expo., Mar. 19-23, 2006
, pp. 871-877
-
-
Hopkins, D.C.1
Kellerman, D.W.2
Wunderlich, R.A.3
Basaran, C.4
Gomez, C.J.5
-
11
-
-
78650893934
-
SiC power devices for microgrids
-
Dec.
-
Q. Zhang, R. Callanan, M. K. Das, S.-H. Ryu, A. K. Agarwal, and J. W. Palmour, "SiC power devices for microgrids," IEEE Trans. Power Electron., vol. 25, no. 12, pp. 2889-2896, Dec. 2010.
-
(2010)
IEEE Trans. Power Electron.
, vol.25
, Issue.12
, pp. 2889-2896
-
-
Zhang, Q.1
Callanan, R.2
Das, M.K.3
Ryu, S.-H.4
Agarwal, A.K.5
Palmour, J.W.6
-
12
-
-
77954149949
-
A novel high-temperature planar package for SiC multichip phase-leg power module
-
Aug.
-
P. Ning, T. G. Lei, F. Wang, G.-Q. Lu, K. D. T. Ngo, and K. Rajashekara, "A novel high-temperature planar package for SiC multichip phase-leg power module," IEEE Trans. Power Electron., vol. 25, no. 8, pp. 2059-2067, Aug. 2010.
-
(2010)
IEEE Trans. Power Electron.
, vol.25
, Issue.8
, pp. 2059-2067
-
-
Ning, P.1
Lei, T.G.2
Wang, F.3
Lu, G.-Q.4
Ngo, K.D.T.5
Rajashekara, K.6
-
13
-
-
0032598883
-
Dynamic characteristics of high voltage 4H-SiC vertical JFETs
-
H. Mitlehner, W. Bartsch, K. O. Dohnke, P. Friedrichs, R. Kaltschmidt, U. Weinert, B. Weis, and D. Stephani, "Dynamic characteristics of high voltage 4H-SiC vertical JFETs," in Proc. 11th Int. Symp. Power Semicond. Devices ICs, May 26-28, 1999, pp. 339-342.
-
Proc. 11th Int. Symp. Power Semicond. Devices ICs, May 26-28, 1999
, pp. 339-342
-
-
Mitlehner, H.1
Bartsch, W.2
Dohnke, K.O.3
Friedrichs, P.4
Kaltschmidt, R.5
Weinert, U.6
Weis, B.7
Stephani, D.8
-
14
-
-
48949097679
-
Strategic considerations for unipolar SiC switch options: JFET versus MOSFET
-
M. Treu, R. Rupp, P. Blaschitz, K. Ruschenschmidt, T. Sekinger, P. Friedrichs, R. Elpelt, and D. Peters, "Strategic considerations for unipolar SiC switch options: JFET versus MOSFET," in Proc. Conf. Record 2007 IEEE Ind. Appl. Conf. (42nd IAS Annu. Meet. 2007), Sep. 23-27, 2007, pp. 324-330.
-
Proc. Conf. Record 2007 IEEE Ind. Appl. Conf. (42nd IAS Annu. Meet. 2007), Sep. 23-27, 2007
, pp. 324-330
-
-
Treu, M.1
Rupp, R.2
Blaschitz, P.3
Ruschenschmidt, K.4
Sekinger, T.5
Friedrichs, P.6
Elpelt, R.7
Peters, D.8
-
15
-
-
33749509055
-
SiC JFET gate driver design for use in DC/DC converters
-
R. Kelley and M. S. Mazzola, "SiC JFET gate driver design for use in DC/DC converters," in Proc. 21st Annu. IEEE Appl. Power Electron. Conf. Expo., Mar. 19-23, 2006, pp. 179-182.
-
Proc. 21st Annu. IEEE Appl. Power Electron. Conf. Expo., Mar. 19-23, 2006
, pp. 179-182
-
-
Kelley, R.1
Mazzola, M.S.2
-
16
-
-
34249702955
-
Silicon carbide junction field effect transistors
-
D. Stephani and P. Friedrichs, "Silicon carbide junction field effect transistors," Int. J. High Speed Electron. Syst., vol. 16, no. 3, pp. 825-854, 2006.
-
(2006)
Int. J. High Speed Electron. Syst.
, vol.16
, Issue.3
, pp. 825-854
-
-
Stephani, D.1
Friedrichs, P.2
-
17
-
-
77950869499
-
Comparison of SiC and Si power semiconductor devices to be used in 2.5 kW DC/DC converter
-
M. G. H. Aghdam and T. Thiringer, "Comparison of SiC and Si power semiconductor devices to be used in 2.5 kW DC/DC converter," Int. Conf. Power Electron. Drive Syst., Nov. 2-5, 2009, pp. 1035-1040.
-
Int. Conf. Power Electron. Drive Syst., Nov. 2-5, 2009
, pp. 1035-1040
-
-
Aghdam, M.G.H.1
Thiringer, T.2
-
18
-
-
80053473424
-
Experimental comparison of dc-dc boost converters with SiC JFETs and SiC bipolar transistors
-
D. Peftitsis, J. Rabkowski, G. Tolstoy, and H.-P. Nee, "Experimental comparison of dc-dc boost converters with SiC JFETs and SiC bipolar transistors," in Proc. 14th Eur. Conf. Power Electron. Appl., Aug. 30 -Sep. 1, 2011, pp. 1-9.
-
Proc. 14th Eur. Conf. Power Electron. Appl., Aug. 30 -Sep. 1, 2011
, pp. 1-9
-
-
Peftitsis, D.1
Rabkowski, J.2
Tolstoy, G.3
Nee, H.-P.4
-
19
-
-
71849108934
-
Silicon Carbide power devices - Status and upcoming challenges
-
P. Friedrichs, "Silicon Carbide power devices - Status and upcoming challenges," in Proc. Eur. Conf. Power Electron. Appl., Aalborg, Denmark, Sep. 2-5, 2007, pp. 1-11.
-
Proc. Eur. Conf. Power Electron. Appl., Aalborg, Denmark, Sep. 2-5, 2007
, pp. 1-11
-
-
Friedrichs, P.1
-
20
-
-
0034449682
-
The field stop IGBT (FS IGBT) - A new power device concept with a great improvement potential
-
T. Laska, M. Munzer, F. Pfirsch, C. Schaeffer, and T. Schmidt, "The field stop IGBT (FS IGBT) - A new power device concept with a great improvement potential," in Proc. 12th Int. Symp. Power Semicond. Devices ICs, May 22-25, 2000, pp. 355-358.
-
Proc. 12th Int. Symp. Power Semicond. Devices ICs, May 22-25, 2000
, pp. 355-358
-
-
Laska, T.1
Munzer, M.2
Pfirsch, F.3
Schaeffer, C.4
Schmidt, T.5
-
21
-
-
57849091780
-
Practical design considerations of power electronics in hybrid and fuel cell vehicles
-
J. Wang, "Practical design considerations of power electronics in hybrid and fuel cell vehicles," Proc. IEEE Veh. Power Propulsion Conf., Sep. 3-5, 2008, pp. 1-6.
-
Proc. IEEE Veh. Power Propulsion Conf., Sep. 3-5, 2008
, pp. 1-6
-
-
Wang, J.1
-
22
-
-
84894385602
-
-
Apr. 17, [Online]. Aavailable at
-
"Toyota's Develops New Hybrid System," (Apr. 17, 2003). [Online]. Aavailable at: http://www.toyotagb-press.co.uk/protected/corporate/ environment/THS-II.pdf.
-
(2003)
Toyota's Develops New Hybrid System
-
-
-
23
-
-
51849111562
-
Switch-Mode Power Supplies: SPICE Simulations and Practical Designs
-
New York: McGraw-Hill
-
C. P. Basso, Switch-Mode Power Supplies: SPICE Simulations and Practical Designs, (Electronic Engineering Series), New York: McGraw-Hill, 2008.
-
(2008)
Electronic Engineering Series
-
-
Basso, C.P.1
-
24
-
-
84894341148
-
Efficiency improvement with silicon carbide based power modules
-
X. Zhang, D. Domes, and R. Rupp, "Efficiency improvement with silicon carbide based power modules," in Proc. PCIM Europe Conf., Nürnberg 2009, pp. 323-327.
-
Proc. PCIM Europe Conf., Nürnberg 2009
, pp. 323-327
-
-
Zhang, X.1
Domes, D.2
Rupp, R.3
-
25
-
-
33745003549
-
ThinQ! silicon carbide schottky diodes: An SMPS circuit designer's dream comes true!
-
C. Miesner, R. Rupp, H. Kapels, M. Krach, and I. Zverev, "ThinQ! silicon carbide schottky diodes: An SMPS circuit designer's dream comes true!," Infineon Technologies Appl. Notes (Technical White Paper).
-
Infineon Technologies Appl. Notes (Technical White Paper)
-
-
Miesner, C.1
Rupp, R.2
Kapels, H.3
Krach, M.4
Zverev, I.5
-
26
-
-
27944495130
-
Switching performance characterization of SiC Schottky diodes in switch-mode DC-DC converters
-
Dec. 8-10
-
R. L. S. Libby, L. G. Sison, and M. dela Cruz, "Switching performance characterization of SiC Schottky diodes in switch-mode DC-DC converters," in Proc. IEEE Int. Conf. Ind. Technol., Dec. 8-10, 2004, vol. 2, pp. 628-633.
-
(2004)
Proc. IEEE Int. Conf. Ind. Technol.
, vol.2
, pp. 628-633
-
-
Libby, R.L.S.1
Sison, L.G.2
Dela Cruz, M.3
-
27
-
-
79952632921
-
SiC schottky diodes improve boost converter performance
-
Mar.
-
I. Zverev, "SiC schottky diodes improve boost converter performance," Power Electron. Technol., vol. 29, pp. 38-49, Mar. 2003.
-
(2003)
Power Electron. Technol.
, vol.29
, pp. 38-49
-
-
Zverev, I.1
-
28
-
-
79957558715
-
Gate driver for SiC JFETs with protection against normally-on behaviour induced fault
-
17 Mar.
-
F. Guédon, S. K. Singh, R. A. McMahon, and F. Udrea, "Gate driver for SiC JFETs with protection against normally-on behaviour induced fault," Electron. Lett., vol. 47, no. 6, pp. 375-377, 17 Mar. 2011.
-
(2011)
Electron. Lett.
, vol.47
, Issue.6
, pp. 375-377
-
-
Guédon, F.1
Singh, S.K.2
McMahon, R.A.3
Udrea, F.4
-
29
-
-
45149105016
-
Unipolar SiC devices - Latest achievements on the way to a new generation of high voltage power semiconductors
-
Aug. 14-16
-
P. Friedrichs, "Unipolar SiC devices - Latest achievements on the way to a new generation of high voltage power semiconductors," in Proc. CES/IEEE 5th Int.Power Electron. Motion Control Conf., Aug. 14-16, 2006, vol. 1, pp. 1-5.
-
(2006)
Proc. CES/IEEE 5th Int.Power Electron. Motion Control Conf.
, vol.1
, pp. 1-5
-
-
Friedrichs, P.1
-
30
-
-
70349329132
-
Efficiency of SiC JFET-Based Inverters
-
H. Zhang and L. M. Tolbert, "Efficiency of SiC JFET-Based Inverters," in Proc. 4th IEEE Conf. Ind. Electron. Appl., May 25-27, 2009, pp. 2056-2059.
-
Proc. 4th IEEE Conf. Ind. Electron. Appl., May 25-27, 2009
, pp. 2056-2059
-
-
Zhang, H.1
Tolbert, L.M.2
-
31
-
-
59849115195
-
Maximum junction temperatures of SiC power devices
-
Feb.
-
K. Sheng, "Maximum junction temperatures of SiC power devices," IEEE Trans. Electron Devices, vol. 56, no. 2, pp. 337-342, Feb. 2009.
-
(2009)
IEEE Trans. Electron Devices
, vol.56
, Issue.2
, pp. 337-342
-
-
Sheng, K.1
-
32
-
-
48349121988
-
Three-phase Ac buck rectifier using normally-on SiC JFETs at 150 kHz switching frequency
-
C. J. Cass, R. Burgos, F. Wang, and D. Boroyevich, "Three-phase Ac buck rectifier using normally-on SiC JFETs at 150 kHz switching frequency," in Proc. Power Electron. Spec. Conf., 2007, pp. 2162-2167.
-
Proc. Power Electron. Spec. Conf., 2007
, pp. 2162-2167
-
-
Cass, C.J.1
Burgos, R.2
Wang, F.3
Boroyevich, D.4
|