High-temperature, high-density packaging of a 60kW converter for >200°C embedded operation

Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC

Volumn 2006, Issue , 2006, Pages 871-877

  Hopkins, D C ^a   Kellerman, D W ^b   Wunderlich, R A ^c   Basaran, C ^a   Gomez, J ^a  

^a UNIVERSITY AT BUFFALO   (United States)

^b Material Solutions LLC   (United States)

^c Innovative Ideas and Designs   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AIR-COOLED DESIGN; ALSIC; ALUMINUM CONDUCTORS; HIGH-DENSITY PACKAGING;

ACTUATORS; ALUMINUM COMPOUNDS; ELECTRIC CONVERTERS; ELECTRIC MOTORS; EMBEDDED SYSTEMS; SILICON CARBIDE;

ELECTRONICS PACKAGING;

EID: 33749506452     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (2)

1. D.C. Hopkins, J. M. Pitarressi and J. A. Karker, "Systems Design Considerations for Using a Direct-Attached-Ceramic MMC Power Package," PCIM '96 EUROPE. Proc. 32nd Int'l Power Conversion Conf. 1996, pp.683-9 Nurnberg, Germany
2. Lin, J.C. and Chan, J.Y. "On the Resistance of Silver Migration in Ag-Pd Conductive Thick Films under Humid Environment and Applied DC Field.", Materials Chemistry and Physics 43 (1996) 256-265