메뉴 건너뛰기




Volumn , Issue , 2010, Pages 1842-1848

High power SiC modules for HEVs and PHEVs

Author keywords

Efficiency; HEV; Hybrid electric vehicle; Inverter; JFET; PHEV; Silicon carbide

Indexed keywords

HEV; HYBRID ELECTRIC VEHICLE; INVERTER; JFET; PHEV;

EID: 77956547372     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPEC.2010.5542158     Document Type: Conference Paper
Times cited : (23)

References (20)
  • 1
    • 77956520430 scopus 로고    scopus 로고
    • November [Online]. Available
    • Freedom Car & Fuels Roadmap, November 2006. [Online]. Available: www1.eere.energy.gov/vehiclesandfuels/pdfs/program/eett-roadmap.pdf
    • (2006) Freedom Car & Fuels Roadmap
  • 2
    • 33646891147 scopus 로고    scopus 로고
    • Silicon carbide benefits and advantages for power electronics circuits and systems
    • June
    • A. Elasser, T.P. Chow, "Silicon carbide benefits and advantages for power electronics circuits and systems," Proceeding of IEEE, vol. 90, no. 6, pp. 969-986, June 2002.
    • (2002) Proceeding of IEEE , vol.90 , Issue.6 , pp. 969-986
    • Elasser, A.1    Chow, T.P.2
  • 5
    • 84876890619 scopus 로고    scopus 로고
    • A high-temperature, high-voltage SOI gate driver IC with high output current and on-chip low-power temperature sensor
    • San Jose, California, Nov. 1-5
    • M. A Huque, L. M. Tolbert, B. J. Blalock, S. K. Islam, "A high-temperature, high-Voltage SOI gate driver IC with high output current and on-chip low-power temperature sensor," IMAPS International Symposium on Microelectronics, San Jose, California, Nov. 1-5, 2009, 8 pages.
    • (2009) IMAPS International Symposium on Microelectronics , pp. 8
    • Huque, M.A.1    Tolbert, L.M.2    Blalock, B.J.3    Islam, S.K.4
  • 8
    • 77952200634 scopus 로고    scopus 로고
    • 18 kW three phase inverter system using hermetically sealed SiC phase-leg power modules
    • Palm Springs, California, Feb. 21-25
    • H. Zhang, M. Chinthavali, L. M. Tolbert, J. H. Han, F. Barlow, "18 kW three phase inverter system using hermetically sealed SiC phase-leg power modules," IEEE Applied Power Electronics Conference, Palm Springs, California, Feb. 21-25, 2010, pp. 1108-1112.
    • (2010) IEEE Applied Power Electronics Conference , pp. 1108-1112
    • Zhang, H.1    Chinthavali, M.2    Tolbert, L.M.3    Han, J.H.4    Barlow, F.5
  • 10
    • 57949084938 scopus 로고    scopus 로고
    • Impact of SiC devices on hybrid electric and plug-in hybrid electric vehicles
    • Edmonton, Canada, October 5-9
    • H. Zhang, L. M. Tolbert, B. Ozpineci, "Impact of SiC devices on hybrid electric and plug-in hybrid electric vehicles," IEEE Industry Applications Society Annual Meeting, Edmonton, Canada, October 5-9, 2008, 5 pages.
    • (2008) IEEE Industry Applications Society Annual Meeting , pp. 5
    • Zhang, H.1    Tolbert, L.M.2    Ozpineci, B.3
  • 14
    • 77952201324 scopus 로고    scopus 로고
    • High-temperature high-power packaging techniques for HEV traction applications
    • published by UT-Battelle, LLC, Oak Ridge National Laboratory, Oak Ridge, Tennessee, Nov.
    • F. Barlow and A. Elshabini, "High-temperature high-power packaging techniques for HEV traction applications", ORNL/TM-2006/515, published by UT-Battelle, LLC, Oak Ridge National Laboratory, Oak Ridge, Tennessee, Nov. 2006.
    • (2006) ORNL/TM-2006/515
    • Barlow, F.1    Elshabini, A.2
  • 16
    • 0021649874 scopus 로고
    • Effects of ambient atmosphere on aluminum-copper wirebond reliability
    • December
    • D. Olsen, K. James, "Effects of ambient atmosphere on aluminum-copper wirebond reliability," IEEE Transactions on Hybrids and Manufacturing Technology, vol. 7, no. 4, December 1984, pp. 357-362.
    • (1984) IEEE Transactions on Hybrids and Manufacturing Technology , vol.7 , Issue.4 , pp. 357-362
    • Olsen, D.1    James, K.2
  • 17
    • 0017531969 scopus 로고
    • Hybrid microcircuitry for 300°C operation
    • September
    • D. Palmer, "Hybrid microcircuitry for 300°C operation," IEEE Transactions on Parts, Hybrids, and Packaging, vol. 13, no. 3, September 1977, pp. 252-257.
    • (1977) IEEE Transactions on Parts, Hybrids, and Packaging , vol.13 , Issue.3 , pp. 252-257
    • Palmer, D.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.