Interface mechanism of ultrasonic flip chip bonding

Applied Physics Letters

Volumn 90, Issue 24, 2007, Pages

  Li, J ^a   Han, L ^a   Duan, J ^a   Zhong, J ^a  

^a CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

DIFFUSION; DISLOCATIONS (CRYSTALS); INTERFACES (MATERIALS); INTERMETALLICS; ULTRASONICS;

DISLOCATION LINES; FLIP CHIP (FC) BONDING; INTERFACE MECHANISM; ULTRASONIC ENERGY;

FLIP CHIP DEVICES;

EID: 34250668461     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2747673     Document Type: Article

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