High-precision alignment and bonding system for the fabrication of 3-D nanostructures

Journal of Microelectromechanical Systems

Volumn 16, Issue 5, 2007, Pages 1140-1144

  Kawashima, Shoichi ^a   Imada, Masahiro ^a   Ishizaki, Kenji ^a   Noda, Susumu ^a  

^a KYOTO UNIVERSITY   (Japan)

Author keywords

3 D integration; Microassembly; Micromachining; Nanostructure; Nanotechnology; Periodic structure; Photonic crystal; Wafer bonding

Indexed keywords

INTERFEROMETRY; MICROMACHINING; NANOTECHNOLOGY; PERIODIC STRUCTURES; PHOTONIC CRYSTALS; THREE DIMENSIONAL; WAFER BONDING;

ALIGNMENT METHOD; NANOSCALE MULTILAYER DEVICES;

NANOSTRUCTURES;

EID: 34948882304     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2007.904950     Document Type: Article

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