Effects of bonding parameters on the lighting performance of high power LEDs fabricated by thermosonic flip chip bonding

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2007, Pages

  Kun, Zhao ^a   Jianhua, Zhang ^a   Ji'an, Duan ^b  

^a SHANGHAI UNIVERSITY   (China)

^b CENTRAL SOUTH UNIVERSITY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC POWER UTILIZATION; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; LIGHT EMITTING DIODES; PARAMETER ESTIMATION;

BONDING PARAMETERS; THERMOSONIC FLIP CHIP BONDING;

WAFER BONDING;

EID: 34948894350     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359781     Document Type: Conference Paper

References (10)

1. F.K. Yam, Z. Hassan, "Innovative advances in LED technology", Microelectronics Journal, 36 (2005) pp. 129-137
2. J. J. Wierer,a) D. A. Steigerwald, M. R. Krames et al, High-power AlGaInN flip-chip light-emitting diodes. Applied Physics Letters. Vol. 78, No. 22. pp.3379-3391
3. S.Y. Kang, P.M. Williams, T.S. Melaren, Y.C. Lee. Studies of thermosonic bonding for flip-chip assembly. Materials Chemistry and Physics 42 (1995) 31-37.
4. Jürg Schwizer, Michael Mayer, Daniel Bolliger, Oliver Paul, Henry Baltes, Thermosonic Ball Bonding Friction Model Based on Integrated Microsensor Measurements, IEEE Intl. Electronic Manufacturing Technology Symposium '99, pp. 108-114
5. Cheah L K, Tan Y M, Wei J et al. Gold to gold themosonic flip-chip bonding. The international conference & exhibition on high density interconnect and systems packaging,USA,2001.
6. Li Hing Leung, Marchy, Chan Lai-Wah, Helen I, Liu Chou-Kee, Peter. Comparison of Bonding Defects for Longitudinal and Transverse Thermosonic Flip-Chip. 2003 Electronics Packaging Technology Conference. pp.350-355
7. Yong Liu, Scott Irving, Timwah Luk. Thermosonic Wire Bonding Process Simulation and Bond Pad Over Active Stress Analysis. 2004 Electronic Components and Technology Conference, pp.383-391
8. Jun Qi, Ngar Chun Hung, Ming Li, Deming Liu, Effects of process parameters on bondability in ultrasonic ball bonding, Scripta Materialia 54 (2006) pp.293-297
9. C.F. Luk, Y.C. Chan, K.C. Hung. Development of Gold to Gold Interconnection Flip Chip Bonding for Chip On Suspension Assemblies. Microelectronics Reliability 42 (2002) pp.381-389
10. Kun Zhao, Lei Jia, Ji'an Duan, Jianhua Zhang. Effects of Thermosonic Bonding Parameters on Flip Chip LEDs. 2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis. pp.297-303