SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 40, Issue 9, 2011, Pages 1903-1911

Effects of cooling rate and composition on mechanical properties of directionally solidified Pb 100-x -Sn x solders

(3) Cadirli E a Kaya, H b Sahin M a

a NIGDE UNIVERSITY (Turkey)

b ERCIYES UNIVERSITY (Turkey)

Author keywords

Dendritic growth; eutectic microstructure; microhardness; tensile strength

Indexed keywords

COOLING RATES; DENDRITIC GROWTH; DIRECTIONAL SOLIDIFICATION FURNACE; DIRECTIONALLY SOLIDIFIED; EUTECTIC MICROSTRUCTURE; EUTECTIC SPACINGS; MICROSTRUCTURE PARAMETERS; PRIMARY DENDRITE ARM SPACINGS; ULTIMATE TENSILE STRENGTH;

COOLING; EUTECTICS; LEAD; MECHANICAL PROPERTIES; MICROHARDNESS; MICROSTRUCTURE; SOLIDIFICATION; TENSILE STRENGTH;

TIN;

EID: 80051598557 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-011-1668-z Document Type: Article

Times cited : (8)

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