Deep reactive ion etching of sub-micrometer trenches with ultra high aspect ratio

Microelectronic Engineering

Volumn 113, Issue , 2014, Pages 35-39

  Parasuraman, Jayalakshmi ^a   Summanwar, Anand ^b   Marty, Frédéric ^a   Basset, Philippe ^a   Angelescu, Dan E ^a   Bourouina, Tarik ^a  

^a UNIVERSITÉ PARIS EST   (France)

^b SINTEF ICT   (Norway)

Author keywords

Bosch process; Cryogenic process; DRIE; High aspect ratio; MEMS; Sub micrometer

Indexed keywords

BOSCH PROCESS; CRYOGENIC PROCESS; DRIE; HIGH ASPECT RATIO; SUBMICROMETERS;

CRYOGENICS; MEMS; MICROMETERS;

ASPECT RATIO;

EID: 84881295904     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2013.06.010     Document Type: Article

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