Thermomechanical analysis of electrically conductive adhesives

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Mach, Pavel ^a   Bušek, David ^a   Polanský, Radek ^b  

^a CZECH TECHNICAL UNIVERSITY IN PRAGUE   (Czech Republic)

^b UNIVERSITY OF WEST BOHEMIA   (Czech Republic)

Author keywords

[No Author keywords available]

Indexed keywords

BISPHENOLS; COLLOIDAL DISPERSION; CURING PROCESS; ELECTRICALLY CONDUCTIVE ADHESIVES; EPOXY ADHESIVES; GLASS TRANSITION TEMPERATURE; IN-VACUUM; LOSS MODULI; NANOBALLS; STORAGE MODULI; THERMAL EXPANSION COEFFICIENTS; THERMAL PROCESSING; THERMO-MECHANICAL ANALYSIS;

ADHESIVES; CARBON NANOTUBES; CURING; ELECTRIC PROPERTIES; GLASS; MECHANICAL PROPERTIES; PHENOLS; SILVER; TEMPERATURE; THERMAL EXPANSION; VACUUM;

GLASS TRANSITION;

EID: 78651308941     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642859     Document Type: Conference Paper

References (11)

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