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Volumn 34, Issue 8, 2005, Pages 1115-1122

Wetting and reaction of Sn-2.8Ag-0.5Cu-1.0Bi solder with Cu and Ni substrates

(6) Rizvi, M J a,b Chan, Y C a Bailey, C b Lu, H b Islam, M N a Wu, B Y a

a CITY UNIVERSITY OF HONG KONG (Hong Kong)

b UNIVERSITY OF GREENWICH (United Kingdom)

Author keywords

Contact angle; Finite element modeling; Flux; Intermetallic compounds; Sn 2.8Ag 0.5Cu 1.0Bi; Surface tension; Wettability; Wetting force

Indexed keywords

COMPUTER SIMULATION; CONTACT ANGLE; COPPER; FINITE ELEMENT METHOD; INTERMETALLICS; NICKEL; PARAMETER ESTIMATION; REACTION KINETICS; SOLDERING ALLOYS; SURFACE TENSION; WETTING;

FINITE ELEMENT MODELING; FLUX; SN-2.8AG-0.5CU-1.0BI; WETTABILITY; WETTING FORCE;

TIN;

EID: 24144493837 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-005-0239-6 Document Type: Article

Times cited : (44)

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