Solder wetting in a wafer-level flip chip assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 372-377

  Lu, J ^a   Busch, S C ^a   Baldwin, D F ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; PRODUCT DEVELOPMENT; SOLDERING ALLOYS; SUBSTRATES; SURFACE MOUNT TECHNOLOGY; THERMODYNAMIC STABILITY; WETTING;

REFLOW PROCESS; SOLDER BUMPS; SOLDER WETTING; WAFER LEVEL FLIP CHIP ASSEMBLY;

FLIP CHIP DEVICES;

EID: 0034837902     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (12)

1. The great underfill race
2. Wafer-level flip chip: Bumps, flux and underflip
3. Evaluation of fast-flow, fast-cure underfills for flip chip on organic substrate
4. Study on the pressurized underfill encapsulation of flip chips
5. High throughput flip chip processing and reliability analysis using no-flow underfills
6. High reliable and mass production-able flip chip package using non conductive film resin
7. Recent advance on a wafer-level flip chip packaging process
8. Coating and dicing of wafer applied underfills for low cost flip chip processing
9. Wafer scale packaging based on underfill applied at the wafer-level for low-cost flip chip processing
10. Manufacturing of Cu/electroless nickel/Sn-Pb flip chip solder bumps
11. Study on the relationship between the surface composition of copper pads and no-flow underfill fluxing capability
12. A study on wettability and defects behavior of flow-soldered joint using low residue flux