Drop impact reliability of Cu-Zn/Sn-Ag-Cu/Cu-Zn solder joints

2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008

Volumn , Issue , 2008, Pages 236-238

  Kim, Young Min ^a   Kim, Young Ho ^a  

^a Hanyang University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BEFORE AND AFTER; DROP IMPACTS; DROP TESTS; INTERMETALLIC GROWTHS; MICRO-VOIDS; SN-AG-CU; SOLDER BALLS; SOLDER INTERFACES; SOLDER JOINTS; SOLDER WETTING; WETTING LAYERS;

BRAZING; DROPS; PACKAGING MATERIALS; PRINTED CIRCUIT BOARDS; PRINTED CIRCUIT MANUFACTURE; RELIABILITY; SILVER; SOLDERING ALLOYS; WELDING; WETTING; ZINC;

TIN;

EID: 64049089608     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EMAP.2008.4784272     Document Type: Conference Paper

References (10)

1. Chad M. Miller, Iver E. Anderson, and Jack F. Smith, A viable Tin-Lead solder substitute, J. Electron. Mater., 23, 7 (1994)
2. S.K. Kang, R. S. Rai, and S. Purushothaman, Interfacial reactions during soldering with lead-tin eutectic and lead (Pb)-tree, tin-rich solders, 1. Electron. Mater., 25, 1113 (1996)
3. M. McCorMack and S. Jin, Improved Inechanical properties in new, Pb-tree solder alloys, 1. Electron. Mater., 23, 715 (1994)
4. K. Zeng, and K.N. Tu, Six cases of reliability study of Pb-free solder joints in electronic packaging technology, Mater. Sci. Eng. Rep. 38,2,55(2002)
5. JEDEC Solid State Technology Association, JESD22BIIIStandard JESD22-Blll, Board Level Drop Test Method of Components for Handheld Electronic Products (2003)
6. C.Y. Oh, H.R. Roh , and Y.-H Kim: Formation and growth of intermetallic compounds at the interface between Pb-free solder and Cu-Zn UBM. Proc. of International Microelectronics and Packaging Society. 48 (2007)
7. K.N. Tu, T.Y. Lee, 1.W. Jang, L. Li, D.R. Frear, K. Zeng, and 1.K. Kivilahti, Wetting reaction versus solid state aging of eutectic SnPb on Cu, 1. App1. Phys., 89, 9, 4843 (2001)
8. Sung K. Kang, D. Leonard, D.-Y. Shih, L. Gignac, D.W. Henderson, S. Cho, and 1. Yu, Interfacial Reactions of Sn-Ag-Cu Solders Modified by Minor Zn Alloying Addition, IBM Res. Rep. (2005)
9. W. Feng, C. Wang, and M. Morinaga, Electronic structure mechanism for the wettability of Sn-based solder alloys, 1. Electron. Mater. 31, 3, 185 (2002)
10. Y,K. Jee, Y.-H. Ko, Y.-C. Sohn, and 1. Yu, Effect ofZn addition on the interface microstructure and drop reliability. Elecron. Mater. Let. 2, 3, 161 (2006)