-
2
-
-
0000670335
-
Hot embossing - The molding technique for plastic microstructures
-
M. Heckele, W. Bacher, and K.D. Muller Hot embossing-the molding technique for plastic microstructures Microsystem Technologies 4 1998 122 124 (Pubitemid 128529381)
-
(1998)
Microsystem Technologies
, vol.4
, Issue.3
, pp. 122-124
-
-
Heckele, M.1
Bacher, W.2
Muller, K.D.3
-
4
-
-
2942558559
-
Recent progress in nanoimprint technology and its applications
-
L.J. Guo Recent progress in nanoimprint technology and its applications Journal of Physics D: Applied Physics 37 2004 R123 R141
-
(2004)
Journal of Physics D: Applied Physics
, vol.37
-
-
Guo, L.J.1
-
5
-
-
60149088960
-
Nanomoulding with amorphous metals
-
G. Kumar, H.X. Tang, and J. Schroers Nanomoulding with amorphous metals Nature 457 2009 868 873
-
(2009)
Nature
, vol.457
, pp. 868-873
-
-
Kumar, G.1
Tang, H.X.2
Schroers, J.3
-
6
-
-
0038015840
-
Fabrication of high-aspect-ratio polymer-based electrostatic comb drives using the hot embossing technique
-
Y. Zhao, and T. Cui Fabrication of high-aspect-ratio polymer-based electrostatic comb drives using the hot embossing technique Journal of Micromechanics and Microengineering 13 2003 430 435
-
(2003)
Journal of Micromechanics and Microengineering
, vol.13
, pp. 430-435
-
-
Zhao, Y.1
Cui, T.2
-
7
-
-
33744542984
-
Fabrication of PMMA microchip of capillary electrophoresis by optimized UV-LIGA process
-
DOI 10.1088/1742-6596/34/1/145
-
X. Zhu, G. Liu, Y. Xiong, Y. Guo, and Y. Tian Fabrication of PMMA microchip of capillary electrophoresis by optimized UV-LIGA process Journal of Physics: Conference Series 34 2006 875 879 (Pubitemid 43812535)
-
(2006)
Journal of Physics: Conference Series
, vol.34
, Issue.1
, pp. 875-879
-
-
Zhu, X.1
Liu, G.2
Xiong, Y.3
Guo, Y.4
Tian, Y.5
-
8
-
-
0032306631
-
Microfluidic devices for μ-TAS applications fabricated by polymer hot embossing
-
10.1117/12.322081
-
H. Becker, and W. Dietz Microfluidic devices for μ-TAS applications fabricated by polymer hot embossing Proceedings of SPIE 3515 177 1998 10.1117/12.322081
-
(1998)
Proceedings of SPIE
, vol.3515
, Issue.177
-
-
Becker, H.1
Dietz, W.2
-
9
-
-
0035971924
-
Microfabricated plastic chips by hot embossing methods and their applications for DNA separation and detection
-
G.B. Lee, S.H. Chen, W.C. Sung, and Y.H. Lin Microfabricated plastic chips by hot embossing methods and their applications for DNA separation and detection Sensors and Actuators B 75 2001 142 148
-
(2001)
Sensors and Actuators B
, vol.75
, pp. 142-148
-
-
Lee, G.B.1
Chen, S.H.2
Sung, W.C.3
Lin, Y.H.4
-
10
-
-
4544382303
-
The dispensing well plate: A novel nanodispenser for the multiparallel delivery of liquids (DWP Part I)
-
P. Koltay, R. Steger, B. Bohl, and R. Zengerle The dispensing well plate: a novel nanodispenser for the multiparallel delivery of liquids (DWP Part I) Sensors and Actuators A 116 2004 483 491
-
(2004)
Sensors and Actuators A
, vol.116
, pp. 483-491
-
-
Koltay, P.1
Steger, R.2
Bohl, B.3
Zengerle, R.4
-
11
-
-
3142696824
-
Fabrication of optical waveguides in thermosetting polymers using hot embossing
-
C. Choi Fabrication of optical waveguides in thermosetting polymers using hot embossing Journal of Micromechanics and Microengineering 14 2004 945 949
-
(2004)
Journal of Micromechanics and Microengineering
, vol.14
, pp. 945-949
-
-
Choi, C.1
-
12
-
-
33847373707
-
Fabrication of gapless triangular micro-lens array
-
DOI 10.1016/j.sna.2006.05.045, PII S092442470600392X
-
C.T. Pan, and C.H. Su Fabrication of gapless triangular micro-lens array Sensors and Actuators A 134 2007 631 640 (Pubitemid 46349564)
-
(2007)
Sensors and Actuators, A: Physical
, vol.134
, Issue.2
, pp. 631-640
-
-
Pan, C.T.1
Su, C.H.2
-
13
-
-
42449107411
-
Low cost fabrication of the large-area anti-reflection films from polymer by nanoimprint/hot-embossing technology
-
C.J. Ting, M.C. Huang, H.Y. Tsai, C.P. Chou, and C.C. Fu Low cost fabrication of the large-area anti-reflection films from polymer by nanoimprint/hot-embossing technology Nanotechnology 19 2008 205301
-
(2008)
Nanotechnology
, vol.19
, pp. 205301
-
-
Ting, C.J.1
Huang, M.C.2
Tsai, H.Y.3
Chou, C.P.4
Fu, C.C.5
-
14
-
-
79953667541
-
Fabrication of polymer via holes by a combination of hot embossing and indentation processes
-
X. Zhu, and T. Cui Fabrication of polymer via holes by a combination of hot embossing and indentation processes Journal of Micromechanics and Microengineering 21 2011 045032
-
(2011)
Journal of Micromechanics and Microengineering
, vol.21
, pp. 045032
-
-
Zhu, X.1
Cui, T.2
-
15
-
-
0031674888
-
High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS
-
PII S0924424797016518
-
H. Lorenz, M. Despont, N. Fahrni, J. Brugger, P. Vettiger, and P. Renaud High-aspect-ratio, ultrathick, negative-tone near-UV photoresist and its applications for MEMS Sensors and Actuators A 64 1998 33 39 (Pubitemid 128388317)
-
(1998)
Sensors and Actuators, A: Physical
, vol.64
, Issue.1
, pp. 33-39
-
-
Lorenz, H.1
Despont, M.2
Fahrni, N.3
Brugger, J.4
Vettiger, P.5
Renaud, P.6
-
16
-
-
13244287972
-
The properties of demoulding of Ni and Ni-PTFE moulding inserts
-
P. Zhang, G. Liu, Y. Tian, and X. Tian The properties of demoulding of Ni and Ni-PTFE moulding inserts Sensors and Actuators A 118 2005 338 341
-
(2005)
Sensors and Actuators A
, vol.118
, pp. 338-341
-
-
Zhang, P.1
Liu, G.2
Tian, Y.3
Tian, X.4
-
17
-
-
36949035773
-
Research on optimization of the hot embossing process
-
DOI 10.1088/0960-1317/17/12/005, PII S0960131707524605
-
Y. He, J.Z. Fu, and Z.C. Chen Research on optimization of the hot embossing process Journal of Micromechanics and Microengineering 17 2007 2420 2425 (Pubitemid 350242882)
-
(2007)
Journal of Micromechanics and Microengineering
, vol.17
, Issue.12
, pp. 2420-2425
-
-
He, Y.1
Fu, J.-Z.2
Chen, Z.-C.3
-
18
-
-
33847288208
-
Analysis of the demolding forces during hot embossing
-
DOI 10.1007/s00542-006-0225-9, HARMST, High Asprect Ratio Micro Structure Technology Workshop, Gyenogju, Korea, 10-13 June 2005 - part 2
-
Y. Guo, G. Liu, X. Zhu, and Y. Tian Analysis of the demolding forces during hot embossing Microsystem Technologies 13 2007 411 415 (Pubitemid 46324413)
-
(2007)
Microsystem Technologies
, vol.13
, Issue.5-6
, pp. 411-415
-
-
Guo, Y.1
Liu, G.2
Zhu, X.3
Tian, Y.4
-
20
-
-
41149174255
-
Shrinky-Dink microfluidics: 3D polystyrene chips
-
DOI 10.1039/b719029h
-
C.S. Chen, D.N. Breslauer, J.I. Luna, A. Grimes, W.C. Chin, L.P. Lee, and M. Khine Shrinky-Dink microfluidics: 3D polystyrene chips Lab on a Chip 8 2008 622 624 (Pubitemid 351442775)
-
(2008)
Lab on a Chip - Miniaturisation for Chemistry and Biology
, vol.8
, Issue.4
, pp. 622-624
-
-
Chen, C.-S.1
Breslauer, D.N.2
Luna, J.I.3
Grimes, A.4
Chin, W.-C.5
Lee, L.P.6
Khine, M.7
-
21
-
-
0032520299
-
Fabrication of microstructures using shrinkable polystyrene films
-
PII S0924424797016920
-
X.M. Zhao, Y. Xia, J.A. Schueller, Q. Dong, and G.M. Whitesides Fabrication of microstructures using shrinkable polystyrene films Sensors and Actuators A 65 1998 209 217 (Pubitemid 128391952)
-
(1998)
Sensors and Actuators, A: Physical
, vol.65
, Issue.2-3
, pp. 209-217
-
-
Zhao, X.-M.1
Xia, Y.2
Schueller, O.J.A.3
Qin, D.4
Whitesides, G.M.5
-
22
-
-
0031071673
-
Fabrication of polymeric microstructures with high aspect ratios using shrinkable polystyrene films
-
X.M. Zhao, Y. Xia, D. Qin, and G.M. Whitesides Fabrication of polymeric microstructures with high aspect ratios using shrinkable polystyrene films Advanced Materials 9 1997 251 254 (Pubitemid 127527614)
-
(1997)
Advanced Materials
, vol.9
, Issue.3
, pp. 251-254
-
-
Zhao, X.-M.1
Xia, Y.2
Qin, D.3
Whitesides, G.M.4
-
23
-
-
72849120228
-
"print-n-Shrink" technology for the rapid production of microfluidic chips and protein microarrays
-
K. Sollier, C.A. Mandon, K.A. Heyries, L.J. Blum, and C.A. Marquette "Print-n-Shrink" technology for the rapid production of microfluidic chips and protein microarrays Lab on a Chip 9 2009 3489 3494
-
(2009)
Lab on A Chip
, vol.9
, pp. 3489-3494
-
-
Sollier, K.1
Mandon, C.A.2
Heyries, K.A.3
Blum, L.J.4
Marquette, C.A.5
-
26
-
-
0032642561
-
UV-LIGA: A promising and low-cost variant for microsystem technology
-
Perth, WA
-
W. Qu, C. Wenzel, A. Jahn, and D. Zeidler UV-LIGA: a promising and low-cost variant for microsystem technology Proc. Conf. on Optoelectronic and Microelectronic Materials Devices Perth, WA 1998 380 383
-
(1998)
Proc. Conf. on Optoelectronic and Microelectronic Materials Devices
, pp. 380-383
-
-
Qu, W.1
Wenzel, C.2
Jahn, A.3
Zeidler, D.4
-
27
-
-
0035125116
-
Polymerization optimization of SU-8 photoresist and its applications in microfluidic systems and MEMS
-
DOI 10.1088/0960-1317/11/1/304
-
J. Zhang, K.L. Tan, G.D. Hong, L.J. Yang, and H.Q. Gong Polymerization optimization of SU-8 photoresist and its applications in microfluidic systems and MEMS Journal of Micromechanics and Microengineering 11 2001 20 26 (Pubitemid 32138654)
-
(2001)
Journal of Micromechanics and Microengineering
, vol.11
, Issue.1
, pp. 20-26
-
-
Zhang, J.1
Tan, K.L.2
Hong, G.D.3
Yang, L.J.4
Gong, H.Q.5
-
28
-
-
0033321676
-
Chemical mechanical polishing mechanisms of low dielectric constant polymers in copper slurries
-
DOI 10.1149/1.1392632
-
C.L. Borst, D.G. Thakurta, W.N. Gill, and R.J. Gutmann Chemical mechanical polishing mechanisms of low dielectric constant polymers in copper slurries Journal of the Electrochemical Society 146 1999 4309 4315 (Pubitemid 30518601)
-
(1999)
Journal of the Electrochemical Society
, vol.146
, Issue.11
, pp. 4309-4315
-
-
Borst, C.L.1
Thakurta, D.G.2
Gill, W.N.3
Gutmann, R.J.4
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