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Microsystem Technologies
Volumn 4, Issue 3, 1998, Pages 122-124
Hot embossing - The molding technique for plastic microstructures
Author keywords

[No Author keywords available]
Indexed keywords

EID: 0000670335     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s005420050112     Document Type: Article
Times cited : (271)
References (9)
  • 1
    • 0022717983 scopus 로고
    • Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic molding (LIGA Process)
    • Becker E; Ehrfeld W; Hagmann P; Maner A; Münchmeyer; D: (1986) Fabrication of microstructures with high aspect ratios and great structural heights by synchrotron radiation lithography, galvanoforming, and plastic molding (LIGA Process). Microelectronic Engineering 4: 35
    • (1986) Microelectronic Engineering , vol.4 , pp. 35
    • Becker, E.1    Ehrfeld, W.2    Hagmann, P.3    Maner, A.4    Münchmeyer, D.5
  • 3
    • 2542625125 scopus 로고
    • Integration von mikromechanischen und mikroelektronischen Komponenten mit Hilfe der positionierten Abformung auf vorstrukturierten Substraten
    • Both A; Bacher W; Heckele M; Müller KD: (1995) Integration von mikromechanischen und mikroelektronischen Komponenten mit Hilfe der positionierten Abformung auf vorstrukturierten Substraten. FZKA Bericht 5670: 202
    • (1995) FZKA Bericht , vol.5670 , pp. 202
    • Both, A.1    Bacher, W.2    Heckele, M.3    Müller, K.D.4
  • 4
    • 0041474329 scopus 로고
    • Erfahrungen beim Aufbau und Betrieb einer Kleinserienfertigung für LIGA-Spektrometer
    • Hagena OF; Bacher W; Heckele M; Moritz H; Müller C: (1995) Erfahrungen beim Aufbau und Betrieb einer Kleinserienfertigung für LIGA-Spektrometer. FZKA Bericht 5670: 41-44
    • (1995) FZKA Bericht , vol.5670 , pp. 41-44
    • Hagena, O.F.1    Bacher, W.2    Heckele, M.3    Moritz, H.4    Müller, C.5
  • 5
    • 0000734172 scopus 로고    scopus 로고
    • Modular molding equipment for quasi monolithic integration of micromechanical and microelectronic components
    • October 1-3, Besançon, France
    • Heckele M; Bacher W: (1996) Modular molding equipment for quasi monolithic integration of micromechanical and microelectronic components. Proceedings of the 3rd France-Japan Congress on Mechatronics; October 1-3, Besançon, France: 501-504
    • (1996) Proceedings of the 3rd France-Japan Congress on Mechatronics , pp. 501-504
    • Heckele, M.1    Bacher, W.2
  • 6
    • 0029696877 scopus 로고    scopus 로고
    • Fabrication of microlenses by combining silicon technology, mechanical micromachining and plastic molding
    • Köhler U; Guber AE; Bier W; Heckele M; Schaller T: (1996) Fabrication of microlenses by combining silicon technology, mechanical micromachining and plastic molding. SPIE Proc. Ser. 2687: 18; Sensors and Actuators A, 53: 361
    • (1996) SPIE Proc. Ser. , vol.2687 , pp. 18
    • Köhler, U.1    Guber, A.E.2    Bier, W.3    Heckele, M.4    Schaller, T.5
  • 7
    • 2542629927 scopus 로고    scopus 로고
    • Köhler U; Guber AE; Bier W; Heckele M; Schaller T: (1996) Fabrication of microlenses by combining silicon technology, mechanical micromachining and plastic molding. SPIE Proc. Ser. 2687: 18; Sensors and Actuators A, 53: 361
    • Sensors and Actuators A , vol.53 , pp. 361
  • 9
    • 84974961354 scopus 로고
    • Microspectrometer fabricated by the LIGA procecss
    • Müller C; Mohr J: (1993) Microspectrometer fabricated by the LIGA procecss. Interdisciplinary Science Reviews, Vol. 18: 273-279
    • (1993) Interdisciplinary Science Reviews , vol.18 , pp. 273-279
    • Müller, C.1    Mohr, J.2

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.