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Volumn 17, Issue 12, 2007, Pages 2420-2425

Research on optimization of the hot embossing process

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; COMPUTER SIMULATION; OPTIMIZATION; TOPOLOGY;

EID: 36949035773     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/17/12/005     Document Type: Article
Times cited : (73)

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    • From micro- to nanofabrication with soft materials
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  • 9
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    • Modeling and optimization of the hot embossing process for micro- and nanocomponent fabrication
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    • Defect analysis in thermal nanoimprint lithography
    • Yoshihiko H, Yoshida S and Nobuyuki T 2003 Defect analysis in thermal nanoimprint lithography J. Vac. Sci. Technol. B 21 2765-70
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.