Modeling and analysis of power distribution networks in 3-D ICs

IEEE Transactions on Very Large Scale Integration (VLSI) Systems

Volumn 21, Issue 2, 2013, Pages 354-366

  Hu, Xiang ^a   Du, Peng ^b   Buckwalter, James F ^a   Cheng, Chung Kuan ^c  

^a UNIVERSITY OF CALIFORNIA   (United States)

^b GOOGLE INC   (United States)

^c UNIVERSITY OF CALIFORNIA   (United States)

Author keywords

3 D IC; modeling and analysis; power distribution network

Indexed keywords

3-D ICS; DISTRIBUTED MODELS; ELECTRICAL CHARACTERISTIC; FREQUENCY DOMAINS; GLOBAL EFFECTS; LOCAL RESONANCE; LUMPED MODELS; METAL LAYER; MODELING AND ANALYSIS; NOISE BEHAVIOR; ON CHIPS; PHYSICAL MECHANISM; POWER DISTRIBUTION NETWORK; POWER GRIDS; RESONANCE PHENOMENA; ROGUE WAVES; SUPPLY NOISE; TEMPORAL RELATION; TIME DOMAIN;

ELECTRIC NETWORK ANALYSIS; FREQUENCY DOMAIN ANALYSIS; INTEGRATED CIRCUITS; TIME DOMAIN ANALYSIS;

THREE DIMENSIONAL;

EID: 84872862469     PISSN: 10638210     EISSN: None     Source Type: Journal    
DOI: 10.1109/TVLSI.2012.2183904     Document Type: Article

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