Measurement, analysis and improvement of supply noise in 3D ICs

IEEE Symposium on VLSI Circuits, Digest of Technical Papers

Volumn , Issue , 2011, Pages 46-47

  Jain, Pulkit ^a   Jiao, Dong ^a   Wang, Xiaofei ^a   Kim, Chris H ^a  

^a University of Minnesota   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

3-D ICS; ADDITIONAL RESISTANCES; POWER DELIVERY; SUPPLY NOISE; SUPPLY NOISE MEASUREMENTS; THROUGH SILICON VIAS;

ELECTRIC NETWORK ANALYSIS; ELECTRIC POWER TRANSMISSION; INTEGRATED CIRCUIT TESTING; THREE DIMENSIONAL;

VLSI CIRCUITS;

EID: 80052647818     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (4)

1. N. Khan et al., TVLSI, 2009
2. G. Huang et al., EPEP pp. 205-208, 2007
3. J. Gu et al., VLSI Circuits Symp., pp. 126-127, 2007
4. S. Rajapandian, et al., ISSCC, pp. 298-299, 2005