Super-selective cryogenic etching for sub-10 nm features

Nanotechnology

Volumn 24, Issue 1, 2013, Pages

  Liu, Zuwei ^a,b   Wu, Ying ^a,b   Harteneck, Bruce ^a   Olynick, Deirdre ^a  

^a LAWRENCE BERKELEY NATIONAL LABORATORY   (United States)

^b OXFORD INSTRUMENTS PLASMA TECHNOLOGY   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

CRYOGENIC ETCHING; CRYOGENIC PLASMA; ETCH RATES; FEATURE SIZES; GAS CHEMISTRY; HARD MASKS; HIGH ASPECT RATIO; HIGH RESOLUTION; HIGH SELECTIVITY; HIGH THROUGHPUT; LITHOGRAPHIC MASK; LOW DAMAGES; MASK PATTERNS; NANO SCALE; PHOTORESIST MASK; POLYMERIC MASKS; SHRINKING FEATURE SIZES; SUB-100 NM;

ANISOTROPY; ASPECT RATIO; FUNCTIONAL MATERIALS; INDUCTIVELY COUPLED PLASMA; ION BOMBARDMENT; MASKS; NANOTECHNOLOGY; PHOTORESISTS; SULFUR HEXAFLUORIDE;

CRYOGENICS;

EID: 84871017496     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/24/1/015305     Document Type: Article

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