Evaluation of oxide-chemical mechanical polishing characteristics using ceria-mixed abrasive slurry

Electronic Materials Letters

Volumn 8, Issue 5, 2012, Pages 523-528

  Lee, Youngkyun ^a   Seo, Yong Jin ^b   Jeong, Haedo ^a  

^a Pusan National University   (South Korea)

^b Daebul University   (South Korea)

Author keywords

Ceria (CeO 2); chemical mechanical polishing (CMP); diluted silica slurry (DSS); mixed abrasive slurry (MAS); non uniformity; removal rates; single abrasive slurry (SAS)

Indexed keywords

ABRASIVE SLURRIES; MIXED ABRASIVE SLURRIES; NONUNIFORMITY; REMOVAL RATE; SILICA SLURRIES;

ABRASIVES; CERIUM COMPOUNDS; PARTICLE SIZE ANALYSIS; POLISHING; SILICA; SLURRIES;

CHEMICAL MECHANICAL POLISHING;

EID: 84868030098     PISSN: 17388090     EISSN: 20936788     Source Type: Journal    
DOI: 10.1007/s13391-012-2056-4     Document Type: Article

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