Effects of different oxidizers on the W-CMP performance

Materials Science and Engineering: B

Volumn 118, Issue 1-3, 2005, Pages 281-284

  Seo, Yong Jin ^a   Lee, Woo Sun ^b  

^a Daebul University   (South Korea)

^b Chosun University   (South Korea)

Author keywords

Alumina; Oxidizers; W CMP process

Indexed keywords

ATOMIC FORCE MICROSCOPY; CORROSION PROTECTION; DEFECTS; POLISHING; SCANNING ELECTRON MICROSCOPY; SURFACE ROUGHNESS; TUNGSTEN;

OXIDIZERS;ALUMINA; TUNGSTEN-CHEMICAL MECHANICAL POLISHING; W-CMP PROCESS; WITHIN-WAFER NON-UNIFORMITY (WIWNU;

OXIDATION;

EID: 15344346660     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2004.12.064     Document Type: Conference Paper

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