Chemical mechanical polishing performances by filtering and retreatment of used silica abrasives slurry

Microelectronic Engineering

Volumn 77, Issue 3-4, 2005, Pages 358-364

  Seo, Yong Jin ^a   Park, Sung Woo ^a   Kim, Nam Hoon ^b   Chang, Eui Goo ^c   Lee, Woo Sun ^b  

^a Daebul University   (South Korea)

^b Chosun University   (South Korea)

^c Chung Ang University   (South Korea)

Author keywords

Abrasive particles; Chemical mechanical polishing; Cost of consumables; Cost of ownership; Slurry retreatment

Indexed keywords

ABRASIVES; ANNEALING; CHEMICAL POLISHING; COSTS; DIELECTRIC MATERIALS; PARTICLE SIZE ANALYSIS; SCANNING ELECTRON MICROSCOPY; SLURRIES;

ABRASIVE PARTICLES; CHEMICAL MECHANICAL POLISHING (CMP); COST OF CONSUMABLES; COST OF OWNERSHIP; SLURRY TREATMENT;

SILICA;

EID: 15344343325     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2004.12.035     Document Type: Article

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