Application of tungsten slurry for copper-chemical mechanical polishing

Materials Science and Engineering: B

Volumn 118, Issue 1-3, 2005, Pages 285-288

  Seo, Yong Jin ^a   Lee, Woo Sun ^b  

^a Daebul University   (South Korea)

^b Chosun University   (South Korea)

Author keywords

Copper chemical mechanical polishing; Oxidizer; Tungsten slurry

Indexed keywords

COPPER; CORROSION; HYDROGEN PEROXIDE; MICROSTRUCTURE; OXIDATION; PARTICLE SIZE ANALYSIS; POLISHING; SLURRIES;

COPPER FILMS; COPPER-CHEMICAL MECHANICAL POLISHING; OXIDIZER; TUNGSTEN SLURRY;

TUNGSTEN;

EID: 15344339934     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2004.12.065     Document Type: Conference Paper

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