Constitutive and aging behavior of Sn3.0Ag0.5Cu solder alloy

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 32, Issue 4, 2009, Pages 221-232

  Mysore, Kaushik ^a   Subbarayan, Ganesh ^a   Gupta, Vikas ^b   Zhang, Ron ^c  

^a Purdue University   (United States)

^b TEXAS INSTRUMENTS   (United States)

^c SUN MICROSYSTEMS   (United States)

Author keywords

Aging; Anand model; Lead free solders; Power law model; Primary creep; Time hardening creep model

Indexed keywords

AGING; ANAND MODEL; LEAD-FREE SOLDERS; POWER-LAW MODEL; PRIMARY CREEP; TIME-HARDENING CREEP MODEL;

ALLOYS; CERIUM ALLOYS; CREEP; CREEP TESTING; HARDENING; LEAD; SILVER; SOLDERING ALLOYS; STRAIN RATE;

COPPER ALLOYS;

EID: 70350338224     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2009.2024119     Document Type: Article

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