Constitutive modeling of lead-free solders

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces

Volumn 2005, Issue , 2005, Pages 45-49

  Pel, M ^a   Qu, J ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRICAL INTERCONNECTS; LEAD-FREE SOLDER ALLOYS; THERMOMECHANICAL RELIABILITY; THERMOMECHANICAL TESTING;

ELECTRONICS PACKAGING; LEAD; MICROELECTRONICS; SOLDERED JOINTS; VISCOPLASTICITY;

SOLDERING ALLOYS;

EID: 33746555443     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISAPM.2005.1432043     Document Type: Conference Paper

References (10)

1. A. Ku, O. Oetinscitan, J.-D. Saphores, A. Shapirod, J.M. Schoenunp, "Lead-free solders, issues of toxicity, availability and impacts of extraction," Electronic Components and Technology Conference, 2003, pp.47 - 53
2. E. Bradley, "Lead-free solder assembly: impact and opportunity," Electronic Components and Technology Conference, 2003, pp. 41 - 46
3. MICROELECTRONICS PACKAGING METERIALS DATABASE, Center for Information and Numerical Data Analysis and Synthesis(CINDAS), PURDUE UNIVERSITY, version 2.21
4. User manual of ANSYS, Release 7.1
5. G. Z. Wang, Z. N. Cheng, K. Becker and J. Wilde, "Applying Anand model to represent the viscoplastic deformation behavior of solder alloys," Journal of Electronic Packaging, Transactions of the ASME, vol. 123, n3, 2001, pp. 247-253
6. J. Wilde, K. Becker, M. Thoben, W. Blum, T. Jupitz, G. Wang and Z. N. Cheng, "Rate dependent constitutive relations based on Anand model for 92.5Pb5Sn2.5Ag solder," IEEE Transactions on Advanced Packaging, vol. 23, n. 3, pp. 408-414, 2000
7. R., Darveaux, "Solder joint fatigue life model," Proceeding of the TMS Annual Meeting, pp.213-218, 1997
8. M. Pei and J. Qu, "Constitutive modeling of solder materials," unpublished
9. S.B. Brown, K.H. Kim, L. Anand, "An internal variable constitutive model for hot working of metals," International Journal of Plasticity, vol. 5, pp. 95-130, 1989
10. X. Chen, G. Chen and M. Sakane, "Modified anand constitutive model for lead-free solder SN-3.5AG," ITherm 2004 - Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, Jun 1-4 2004, vol. 2, pp. 447-452, 2004