Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2003, Pages 891-897

  Kim, Young Bae ^a   Noguchi, Hiroshi ^a   Amagai, Masazumi ^b  

^a KYUSHU UNIVERSITY   (Japan)

^b Texas Instruments Japan Ltd   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ENERGY DISPERSIVE SPECTROSCOPY; FAILURE (MECHANICAL); FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; LEAD; LEAD ALLOYS; RELIABILITY; SHEAR STRESS; SOLDERING ALLOYS; VIBRATIONS (MECHANICAL);

BALL GRID ARRAYS; EFFECT VON MISSES STRESS; HIGH CYCLE FATIGUE STRENGTH; VIBRATION FATIGUE RELIABILITY;

ELECTRONICS PACKAGING;

EID: 0038688986     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. Basarn, C. et al, "Mechanics of Pb40/Sn60 near-eutectic solder alloy subjected to vibration", Applied Mathematical Modeling, Vol. 22 (1998), pp. 601-627
2. Zhao, Y. et al, "Thermomechanical behavior of micron scale solder joints under dynamic loads", Mechanics of Materials, Vol. 32 (2000), pp. 161-173
3. Amagai, M. et al, "Mechanical characterization of Sn-Ag-based lead-free solders", Micronelectronics Reliability, Vol. 42 (2002), pp. 951-966
4. Liguore, S. et al, "Vibration Fatigue of Surface Mount Techology (SMT) Solder Joints", Pro Annual Reliability and Maintainability Symposium, 1995, pp. 18-26
5. Yang, Q. J. et al, "Vibration reliability characterization of PBGA assembilies", Microelectronics Reliability, Vol. 40 (2000), pp. 1097-1107
6. MIL-STD-883E METHOD-2005.2, 1996, Test Method Standard Microcuits, Department of Dfense
7. Wong, T. E. et al, "Development of BGA Solder Joint Vibration Fatigue Life Prediction Model", Electronic Components and Technology Conf, 1996, pp. 149-154
8. Tu, P. L et al, "Effecto of Intermetallic Compounds on Vibration Fatigue of μ BGA Solder Joint", IEEE TRAN on ADV. PACK., Vol. 24, No. 2 (2001), pp.197-205