Modeling constitutive model effect on reliability of lead-free solder joints

2006 7th International Conference on Electronics Packaging Technology, ICEPT '06

Volumn , Issue , 2006, Pages

  Che, F X ^a   Pang, H L J ^b   Zhu, W H ^a   Sun, Wei ^a   Sun, Anthony Y S ^a  

^a United Test and Assembly Center Ltd UTAC   (Singapore)

^b NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; MATHEMATICAL MODELS; RELIABILITY ANALYSIS; THERMAL CYCLING; VISCOPLASTICITY;

CYCLIC BENDING; ELASTIC-PLASTIC-CREEP (EPC); PLASTIC-BALL-GRID-ARRAY (PBGA);

SOLDERED JOINTS;

EID: 34948858859     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ICEPT.2006.359842     Document Type: Conference Paper

References (20)

1. th Electronic Packaging Technology Conf, Singapore, Dec. 2004, pp.787-792.
2. Dowling, N.E., Mechanics Behavior of Materials: Eneineering Methods for Deformation. Fracture, and Fatigue. Prentice-Hall International Editions (1993).
3. Wang, G.Z., Cheng, Z.N., Becker, K., et al., "Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys", Journal of Electronic Packaging, Vol. 123 (2001), pp.247-253.
4. th Electronic Components and Technology Conf, Las Vegas, May. 2000, pp. 1048-1058.
5. Pang, H.L.J., Seetoh, C.W., and Wang, Z.P., "CBGA Solder Joint Reliability Evaluation Based on ElasticPlastic-Creep Analysis", Journal of Electronic Packaging, Vol. 122 (2000), pp.255-261.
6. th Electronic Packaging Technology Conf, Singapore,Dec. 2003, pp.470-478.
7. th Electronic Components and Technology Conf, Florida, May-Jun. 2005, pp.916-921.
8. th Electronic Components and Technology Conf, Las Vegas, Jun. 2004, pp.737-746.
9. Pang, H.L.J., Chong, D.Y.R., and Low, T.H., "Thermal Cycling Analysis of Flip-Chip Solder Joint Reliability", IEEE Transaction on Components and Packaging Technologies, Vol. 24, No.4 (2001), pp.705-712.
10. th Electronic Components and Technology Conf, Las Vegas, Jun. 2004, pp. 1333-1337.
11. ANSYS Version 7.0 Manual, 2002, Ansys Inc.
12. Pang, H.L.J., Xiong, B.S., and Che, F.X., "Modeling Stress Strain Curves For Lead-Free 95.5Sn-3.8Ag-0.7Cu Solder", Proc Eurosim2004, Brussels, May. 2004, pp.449453.
13. JEDEC Standard, JESD22-A104B, Temperature Cycling, Jul. 2000.
14. Che, F.X., Pang, H.L.J., and Xu, L.H., "IMC Consideration in FEA Simulation for Pb-free Solder Joint Reliability", Proc Inter Society Conference on Thermal Phenomena, San Diego, May-Jun. 2006, pp. 1018-1023.
15. Pang, H.L.J., and Che, F.X., "Isothermal Cyclic Bend Fatigue Test Method For Lead Free Solder Joints", Proc Inter Society Conference on Thermal Phenomena, San Diego, May-Jun. 2006, pp.1011-1017.
16. th Electronic Packaging Technology Conf, Singapore, Dec. 2005, pp.868-872.
17. JEDEC Standard, JESD22-B111: Board Level Drop Test Method of Components for Handheld Electronic Products, 2003.
18. JEDEC Standard, IPC/JEDEC-9702: Monotonie Bend Characterization of Board-Level Interconnects, 2004.
19. Shetty, S., Lehtinen, V., Dasgupta, A., et al., "Fatigue of Chip Scale Package Interconnects Due to Cyclic Bending", Journal of Electronic Packaging, Vol. 123 (2000), pp. 302-308.
20. th Electronic Components and Technology Conference, Las Vegas, Jun. 2004, pp. 1279-1287.