The influence of the Pb-free solder alloy composition and processing parameters on thermal fatigue performance of a ceramic chip resistor

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2009, Pages 423-430

  Coyle, Richard ^a   Reid, Michael ^b   Ryan, Claire ^b   Popowich, Richard ^a   Read, Peter ^a   Fleming, Debra ^a   Collins, Maurice ^b   Punch, Jeff ^b   Chatterji, Indraneel ^c  

^a NOKIA RESEARCH CENTER   (United States)

^b UNIVERSITY OF LIMERICK   (Ireland)

^c NONE

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; CERAMIC CHIPS; CONTROL-CELL; COOLING RATES; DWELL TIME; FATIGUE LIFE; FATIGUE PERFORMANCE; FATIGUE RELIABILITY; INVERSE RELATIONSHIP; MATRIX; OPTICAL METALLOGRAPHY; PB FREE SOLDERS; PB-FREE SOLDER ALLOYS; PROCESSING PARAMETERS; SELF-CONSISTENT METHOD; SILVER CONTENT; SOLDER JOINTS; SOLIDIFICATION RATE; TEMPERATURE CYCLES; TEST MATRIX; TEST RESULTS; TEST VEHICLE; THERMAL PRECONDITIONING;

ALLOYS; AUTOMOBILE PARTS AND EQUIPMENT; CERAMIC MATERIALS; COOLING; FAILURE ANALYSIS; LEAD; MICROSTRUCTURE; OPTICAL MICROSCOPY; QUALITY ASSURANCE; RELIABILITY ANALYSIS; RESISTORS; SAFETY FACTOR; SCANNING ELECTRON MICROSCOPY; SILVER; SILVER ALLOYS; THERMAL FATIGUE;

SOLDERING ALLOYS;

EID: 70349684390     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2009.5074048     Document Type: Conference Paper

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