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Volumn 50, Issue 1, 2013, Pages 455-463

Reliability of thermal interface materials: A review

Author keywords

Accelerated stress test; Reliability; Thermal interface material; TIM degradation

Indexed keywords

ACCELERATED STRESS; DESIGN LIFE; DEVICE PERFORMANCE; ELECTRONIC PACKAGE; ELEVATED TEMPERATURE; END-OF-LIFE PERFORMANCE; MATING PARTS; SELECTION BASED; TEST METHODOLOGY; TEST PROCEDURES; THERMAL CONDUCTION; THERMAL INTERFACE MATERIALS; USEFUL LIFE;

EID: 84866561018     PISSN: 13594311     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.applthermaleng.2012.06.013     Document Type: Conference Paper
Times cited : (200)

References (28)
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    • (2009) IEEE Transactions on Device and Materials Reliability , vol.9 , Issue.3 , pp. 379-391
    • Khuu, V.1    Bar-Cohen, A.2
  • 18
    • 0040154732 scopus 로고    scopus 로고
    • Thermal stability of thermal interface pastes, evaluated by thermal contact conductance measurement
    • X. Luo, Y. Xu, and D.D.L. Chung Thermal stability of thermal interface pastes, evaluated by thermal contact conductance measurement Journal of Electronic Packaging 123 2001 309 311
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    • Luo, X.1    Xu, Y.2    Chung, D.D.L.3
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    • DSC and DMTA studies of a thermal interface material for packaging high speed microprocessors
    • Y. He DSC and DMTA studies of a thermal interface material for packaging high speed microprocessors Thermochimica Acta 392-393 2002 13 21
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    • He, Y.1
  • 28


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.