Reliability testing of silicone-based thermal greases

Annual IEEE Semiconductor Thermal Measurement and Management Symposium

Volumn , Issue , 2005, Pages 64-71

  Gowda, Arun ^a   Esler, David ^a   Paisner, Sara N ^a   Tonapi, Sandeep ^a   Nagarkar, Kaustubh ^b   Srihari, K ^b  

^a GE GLOBAL RESEARCH   (United States)

^b State University of New York   (United States)

Author keywords

Accelerated testing; Reliability; Thermal grease

Indexed keywords

ACCELERATED TESTING; THERMAL GREASE; THERMAL IMPEDANCE; THERMAL INTERFACE MATERIALS (TIM);

COOLING SYSTEMS; HEAT LOSSES; INTERFACES (MATERIALS); MICROELECTRONICS; RELIABILITY; SILICONES; THERMOANALYSIS;

LUBRICATING GREASES;

EID: 23944442123     PISSN: 10652221     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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