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Volumn 2, Issue , 2005, Pages 537-542
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Qualification of phase change thermal interface material for wave solder heat sink on FCBGA package
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Author keywords
[No Author keywords available]
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Indexed keywords
FCBGA PACKAGE;
RELIABILITY STRESSES;
THERMAL DESIGN;
THERMAL INTERFACE MATERIALS (TIM);
WAVE SOLDER HEAT SINK;
ELECTRONICS PACKAGING;
HEAT SINKS;
RELIABILITY;
STATISTICAL METHODS;
STRESSES;
THERMAL CONDUCTIVITY;
INTERFACES (MATERIALS);
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EID: 33847327970
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (12)
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References (5)
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