메뉴 건너뛰기




Volumn 2, Issue , 2005, Pages 537-542

Qualification of phase change thermal interface material for wave solder heat sink on FCBGA package

Author keywords

[No Author keywords available]

Indexed keywords

FCBGA PACKAGE; RELIABILITY STRESSES; THERMAL DESIGN; THERMAL INTERFACE MATERIALS (TIM); WAVE SOLDER HEAT SINK;

EID: 33847327970     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (12)

References (5)
  • 1
    • 10244267454 scopus 로고    scopus 로고
    • Thermal Contact Resistance of Cured Gel Polymeric Thermal Interface Material
    • Prasher, Ravi S. et al, "Thermal Contact Resistance of Cured Gel Polymeric Thermal Interface Material" IEEE Trans-CPT-A, Vol. 27, No. 4 (2004), pp. 702-709
    • (2004) IEEE Trans-CPT-A , vol.27 , Issue.4 , pp. 702-709
    • Prasher, R.S.1
  • 2
    • 0033678272 scopus 로고    scopus 로고
    • Understanding the Performance Characteristics of Phase Change Thermal Interface Materials
    • Rausch, Bob, "Understanding the Performance Characteristics of Phase Change Thermal Interface Materials" Inter Society Conference on Thermal Phenomena (2000), pp. 42-47.
    • (2000) Inter Society Conference on Thermal Phenomena , pp. 42-47
    • Rausch, B.1
  • 3
    • 33847324392 scopus 로고    scopus 로고
    • Characterization and Development of Thermal Interface Material Reliability Performance for FC BGA3/5 Phase I Technology Applications
    • Wong, Shaw Fong, et al, "Characterization and Development of Thermal Interface Material Reliability Performance for FC BGA3/5 Phase I Technology Applications" Intel Assembly and Test Technology Journal Vol 7 (2004).
    • (2004) Intel Assembly and Test Technology Journal , vol.7
    • Wong, S.F.1
  • 4
    • 29744447093 scopus 로고    scopus 로고
    • Interface material selection and a thermal management technique in second generation platforms built on Intel® Centrino™ mobile technology
    • Samson, EC, et al, "Interface material selection and a thermal management technique in second generation platforms built on Intel® Centrino™ mobile technology," Intel Technology Journal, vol 9 (2005), pp. 75-86,
    • (2005) Intel Technology Journal , vol.9 , pp. 75-86
    • Samson, E.C.1
  • 5
    • 3142734321 scopus 로고    scopus 로고
    • Characterisation of Soft Gel Thermal Interface Material for Flip Chip Package
    • May
    • Wang, Jinlin, Characterisation of Soft Gel Thermal Interface Material for Flip Chip Package, 24th International Conference on Microelectronics proceedings (May 2004), pp. 437-440,.
    • (2004) 24th International Conference on Microelectronics proceedings , pp. 437-440
    • Wang, J.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.