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Volumn , Issue , 2009, Pages 219-223
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Method for in-situ reliability testing of TIM samples
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Author keywords
[No Author keywords available]
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Indexed keywords
EXTERNAL COOLING;
HEAT-FLOW;
IN-SITU;
JUNCTION TEMPERATURES;
POWER SEMICONDUCTOR DEVICES;
RELIABILITY TESTING;
THERMAL CYCLE;
THERMAL TRANSIENT MEASUREMENTS;
MATERIALS TESTING;
POWER ELECTRONICS;
SEMICONDUCTOR DEVICE MANUFACTURE;
TECHNOLOGICAL FORECASTING;
THERMAL INSULATING MATERIALS;
TRANSIENT ANALYSIS;
SEMICONDUCTOR JUNCTIONS;
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EID: 71749113990
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper |
Times cited : (7)
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References (7)
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