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Volumn , Issue , 2009, Pages 465-468

High-power-used thermal gel degradation evaluation on board-level HFCBGA subjected to reliability tests

Author keywords

[No Author keywords available]

Indexed keywords

A-THERMAL; BOARD-LEVEL; END USERS; FIELD CONDITIONS; HEAT SPREADERS; HIGH-POWER; REAR SIDE; RELIABILITY TEST; SILICON DIE; STRESS TEST; TEMPERATURE CYCLING TESTS; THERMAL PERFORMANCE; THERMAL RESISTANCE;

EID: 77950801480     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMPACT.2009.5382218     Document Type: Conference Paper
Times cited : (8)

References (10)
  • 2
    • 28444481413 scopus 로고    scopus 로고
    • Voids in thermal interface material layers and their effect on thermal performance
    • Arun Gowda, David Esler, and Sandeep Tonapi, "Voids in thermal interface material layers and their effect on thermal performance," 2004 EPTC, pp. 4146.
    • 2004 EPTC , pp. 41-46
    • Gowda, A.1    Esler, D.2    Tonapi, S.3
  • 3
    • 33745292630 scopus 로고    scopus 로고
    • Solder as thermal interface material for high power devices
    • Fay Hua, Carl Deppisch, "Solder as thermal interface material for high power devices," SMTA Journal, Vol.19, Issue 1, 2006, pp.21-26.
    • (2006) SMTA Journal , vol.19 , Issue.1 , pp. 21-26
    • Hua, F.1    Deppisch, C.2
  • 4
    • 15744396609 scopus 로고    scopus 로고
    • Problems with thermal interface material measurement: Suggestions for improvement
    • Clemens J. M. Lasance, "Problems with thermal interface material measurement: suggestions for improvement," Electronic Cooling, Vol.9, No.4, pp. 22-29, 2003.
    • (2003) Electronic Cooling , vol.9 , Issue.4 , pp. 22-29
    • Lasance, C.J.M.1
  • 6
    • 84885283553 scopus 로고    scopus 로고
    • High effective thermal conductivity test board for leaded surface mount packages
    • JESD51-7, February
    • EIA/JEDEC Standard, "High effective thermal conductivity test board for leaded surface mount packages," JESD51-7, February 1999.
    • (1999) EIA/JEDEC Standard
  • 7
    • 77950826700 scopus 로고    scopus 로고
    • Temperature cycling
    • JESD22-A104-B, July
    • EIA/JEDEC Standard, "Temperature cycling," JESD22-A104-B, July 2000.
    • (2000) EIA/JEDEC Standard
  • 8
    • 77950853585 scopus 로고    scopus 로고
    • Highly-accelerated temperature and humidity stress test (HAST)
    • JESD22-A110-B, February
    • EIA/JEDEC Standard, "Highly-accelerated temperature and humidity stress test (HAST)," JESD22-A110-B, February 1999.
    • (1999) EIA/JEDEC Standard
  • 9
    • 77950813869 scopus 로고    scopus 로고
    • Preconditioning of nonhermetic surface mount devices prior to reliability testing
    • JESD22-A113D, August
    • EIA/JEDEC Standard, "Preconditioning of nonhermetic surface mount devices prior to reliability testing," JESD22-A113D, August 2003.
    • (2003) EIA/JEDEC Standard


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.