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Volumn , Issue , 2009, Pages 465-468
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High-power-used thermal gel degradation evaluation on board-level HFCBGA subjected to reliability tests
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Author keywords
[No Author keywords available]
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Indexed keywords
A-THERMAL;
BOARD-LEVEL;
END USERS;
FIELD CONDITIONS;
HEAT SPREADERS;
HIGH-POWER;
REAR SIDE;
RELIABILITY TEST;
SILICON DIE;
STRESS TEST;
TEMPERATURE CYCLING TESTS;
THERMAL PERFORMANCE;
THERMAL RESISTANCE;
HEAT CONDUCTION;
THREE DIMENSIONAL;
GELS;
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EID: 77950801480
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IMPACT.2009.5382218 Document Type: Conference Paper |
Times cited : (8)
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References (10)
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