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Volumn 2006, Issue , 2006, Pages 942-945
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Thermal imaging for detecting thermal interface issues in assembly and reliability stressing
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Author keywords
Defect; IR; NDE; TIM; Voids
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Indexed keywords
DEFECTS;
INTERFACES (MATERIALS);
PYROLYSIS;
RELIABILITY THEORY;
STRESS ANALYSIS;
THERMAL CYCLING;
SURFACE INFRARED EMISSION;
THERMAL RESPONSE;
THERMAL SIGNATURE;
VOIDS;
INFRARED IMAGING;
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EID: 33845561926
PISSN: None
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/ITHERM.2006.1645447 Document Type: Conference Paper |
Times cited : (15)
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References (6)
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