Edge chipping of silicon wafers in diamond grinding

International Journal of Machine Tools and Manufacture

Volumn 64, Issue , 2013, Pages 31-37

  Gao, Shang ^a   Kang, Renke ^a   Dong, Zhigang ^a   Zhang, B ^b  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

^b UNIVERSITY OF CONNECTICUT   (United States)

Author keywords

Diamond grinding; Edge chipping; Silicon wafer; Wafer thinning

Indexed keywords

CRITICAL THICKNESS; CRYSTALLOGRAPHIC ORIENTATIONS; DIAMOND GRINDING; EDGE CHIPPING; FEED-RATES; GRINDING PROCESS; GRIT SIZE; MACHINING MECHANICS; MACHINING TECHNIQUES; WAFER THINNING;

DIAMONDS; GRINDING (MACHINING);

SILICON WAFERS;

EID: 84865658020     PISSN: 08906955     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijmachtools.2012.08.002     Document Type: Article

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