Study on the subsurface damage distribution of the silicon wafer ground by diamond wheel

Advanced Materials Research

Volumn 126-128, Issue , 2010, Pages 113-118

  Gao, S ^a   Kang, R K ^a   Guo, D M ^a   Huang, Q S ^a  

^a DALIAN UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Diamond grinding wheel; Grinding; Silicon wafer; Subsurface damage

Indexed keywords

DIAMOND GRINDING WHEEL; DIAMOND WHEEL; GRAIN SIZE; GRINDING; RADIAL LOCATIONS; SUB-SURFACE DAMAGE;

ABRASIVES; DIAMONDS; ELECTRIC SPARKS; GRAIN SIZE AND SHAPE; GRINDING (COMMINUTION); GRINDING (MACHINING); GRINDING MACHINES; GRINDING MILLS; GRINDING WHEELS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS;

CRYSTAL ORIENTATION;

EID: 78650930569     PISSN: 10226680     EISSN: None     Source Type: Book Series    
DOI: 10.4028/www.scientific.net/AMR.126-128.113     Document Type: Conference Paper

References (8)

1. Z.J. Pei, S. R. Billingsley and S. Miura: International Journal of Machine Tools and Manufacture, Vol. 39(1999), p. 1103
2. W. Gao, Y.X. Zhang and R.K. Kang: Semiconductor Technology, Vol. 33(2008), p. 876
3. Takayuki Shibata, Shigeru Fujii, Eiji Makino, Masayuki Ikeda: Precision Engineering, Vol. 18(1996), p. 129
4. Y.B. Tian: Study on Grinding-based Flattening Theory and Process Technology for Large-sized Silicon Wafer (Ph.D., Dalian University of Technology, China 2007) p.33
5. H.K. Tönshoff, W.V. Schmieden, I. Inasaki, W. König and G. Spur: Annals of the CIRP, Vol. 39(1990), p. 621
6. H. K. Tonshoff, B. Karpuschewski, M. Hartmann and C. Spengler: Machining Science and Technology, Vol. 1(1997), p. 33
7. F.W. Huo, R.K. Kang, D.M. Guo, F.l. Zhao and Z.J. Jin: Chinese Journal of Semiconductors, Vol. 27(2006), p. 506
8. K.H. Yang: Journal of the Electrochemical Society, Vol. 131(1984), p. 1140