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Volumn 107, Issue 3, 2004, Pages 321-331
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Rotational grinding of silicon wafers - Sub-surface damage inspection
a
Okmetic Oyj
(Finland)
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Author keywords
Metrology; Silicon wafer; Sub surface damage
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Indexed keywords
CHEMICAL MECHANICAL POLISHING;
CORRELATION METHODS;
CRYSTAL LATTICES;
GRINDING (MACHINING);
MEASUREMENTS;
OPTIMIZATION;
SCANNING ELECTRON MICROSCOPY;
SURFACE TOPOGRAPHY;
X RAY DIFFRACTION ANALYSIS;
OPTICAL METHODS;
SUB-SURFACE DAMAGE;
SILICON WAFERS;
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EID: 1542305368
PISSN: 09215107
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mseb.2003.12.008 Document Type: Article |
Times cited : (49)
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References (15)
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