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Volumn 107, Issue 3, 2004, Pages 321-331

Rotational grinding of silicon wafers - Sub-surface damage inspection

Author keywords

Metrology; Silicon wafer; Sub surface damage

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CORRELATION METHODS; CRYSTAL LATTICES; GRINDING (MACHINING); MEASUREMENTS; OPTIMIZATION; SCANNING ELECTRON MICROSCOPY; SURFACE TOPOGRAPHY; X RAY DIFFRACTION ANALYSIS;

EID: 1542305368     PISSN: 09215107     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mseb.2003.12.008     Document Type: Article
Times cited : (49)

References (15)
  • 7
    • 0012683263 scopus 로고
    • Leipzig: Deutscher Verlag für Grundstofftechnik (in German)
    • H.-F. Hadamovsky (Ed.), Werkstoffe der Halbleitertechnik. Leipzig: Deutscher Verlag für Grundstofftechnik, 1990 (in German).
    • (1990) Werkstoffe der Halbleitertechnik
    • Hadamovsky, H.-F.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.