State-of-the-art technologies and kinematical analysis for one-stop finishing of φ300 mm Si wafer

Journal of Materials Processing Technology

Volumn 129, Issue 1-3, 2002, Pages 34-40

  Zhou, L B ^a   Eda, H ^a   Shimizu, J ^a  

^a IBARAKI UNIVERSITY   (Japan)

Author keywords

Alignment; Ductile mode grinding; Fixed abrasive process; Flatness; Polishing like finishing; Positioning; Roughness; Si wafer

Indexed keywords

ABRASIVES; ENERGY UTILIZATION; KINEMATICS; POLISHING; SLURRIES; SURFACE ROUGHNESS; THROUGHPUT;

INTEGRATED SOLUTIONS;

SILICON WAFERS;

EID: 0037063909     PISSN: 09240136     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0924-0136(02)00571-X     Document Type: Conference Paper

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4. Adly A.A., Mayergoyz I.D. Preisach modelling of magnetostrictive hysteresis J. Appl. Phys. 69 8 1991 5777.
5. K. Kimura, et al., Characteristics of CMP using hard wheel pad, Proc. JSPE (1988) 245 (in Japanese).