Fabrication and evaluation for extremely thin Si wafer

International Journal of Abrasive Technology

Volumn 1, Issue 1, 2007, Pages 94-105

  Zhou, Libo ^a   Hosseini, Bahman Soltani ^a   Tsuruga, Tatsuya ^a   Shimizu, Jun ^a   Eda, Hiroshi ^a   Kamiya, Sumio ^b   Iwase, Hisao ^b   Tashiro, Yoshiaki ^c  

^a IBARAKI UNIVERSITY   (Japan)

^b TOYOTA MOTOR CORPORATION   (Japan)

^c Tokyo Diamond Tool Mfg Co   (Japan)

Author keywords

chemo mechanical grinding; CMG; depth of damaged layer; fixed abrasive process; residual stress; silicon wafer; subsurface damage

Indexed keywords

EID: 84945725744     PISSN: 17522641     EISSN: 1752265X     Source Type: Journal    
DOI: 10.1504/IJAT.2007.013852     Document Type: Article

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