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Volumn 97, Issue , 2012, Pages 126-129

Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

Author keywords

Cu; Electroplating; Emulsion; Supercritical carbon dioxide; Suspension; Wiring

Indexed keywords

CONVENTIONAL METHODS; CU ELECTROPLATING; CU FILMS; FILL HOLES; GAP FILLING; HIGH ASPECT RATIO; NANO SCALE; SUPERCRITICAL CARBON DIOXIDES;

EID: 84865517260     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2012.02.031     Document Type: Article
Times cited : (18)

References (19)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.