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Volumn 97, Issue , 2012, Pages 126-129
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Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles
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Author keywords
Cu; Electroplating; Emulsion; Supercritical carbon dioxide; Suspension; Wiring
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Indexed keywords
CONVENTIONAL METHODS;
CU ELECTROPLATING;
CU FILMS;
FILL HOLES;
GAP FILLING;
HIGH ASPECT RATIO;
NANO SCALE;
SUPERCRITICAL CARBON DIOXIDES;
ASPECT RATIO;
CARBON DIOXIDE;
COPPER;
ELECTRIC WIRING;
ELECTROLYTES;
ELECTROPLATING;
EMULSIFICATION;
EMULSIONS;
FILLING;
NANOTECHNOLOGY;
SUPERCRITICAL FLUID EXTRACTION;
SUSPENSIONS (FLUIDS);
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EID: 84865517260
PISSN: 01679317
EISSN: None
Source Type: Journal
DOI: 10.1016/j.mee.2012.02.031 Document Type: Article |
Times cited : (18)
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References (19)
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