New electroplating method of nickel in emulsion of supercritical carbon dioxide and electroplating solution to enhance uniformity and hardness of plated film

Thin Solid Films

Volumn 446, Issue 2, 2004, Pages 194-199

  Yoshida, Hideo ^a   Sone, Masato ^a   Wakabayashi, Hiroaki ^a   Yan, Hao ^a   Abe, Kentaro ^a   Tao, Xu Tang ^a   Mizushima, Aya ^a   Ichihara, Shoji ^a   Miyata, Seizo ^a  

^a TOKYO UNIVERSITY OF AGRICULTURE AND TECHNOLOGY   (Japan)

Author keywords

Carbon dioxide; Electrochemistry; Nickel; Surface roughness

Indexed keywords

BLOCK COPOLYMERS; CARBON DIOXIDE; DISSOCIATION; ELECTROPLATING; ELECTROPLATING SOLUTIONS; EMULSIONS; GRAIN SIZE AND SHAPE; HARDNESS; HYDROGEN; SOLUBILITY; SUPERCRITICAL FLUIDS; SURFACE ACTIVE AGENTS; SURFACE ROUGHNESS; SYNCHROTRON RADIATION; THIN FILMS;

VICKERS HARDNESS;

NICKEL;

EID: 0348011346     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2003.09.072     Document Type: Article

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