A study on seed damage in plating electrolyte and its repairing in CU damascene metallization

Journal of the Electrochemical Society

Volumn 157, Issue 4, 2010, Pages

  Cho, Sung Ki ^a   Lim, Taeho ^a   Lee, Hong Kee ^b   Kim, Jae Jeong ^a  

^a Seoul National University   (South Korea)

^b Korea Institute of Industrial Technology   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

BARRIER SURFACES; CU DAMASCENE; CU ELECTROPLATING; CU OXIDE; DAMASCENE PROCESS; ELECTROLESS; FILM PROPERTIES; METALLIZATIONS; REPAIRING PROCESS; SEED DAMAGE; SEED LAYER; SUPERFILLING;

COPPER; CORROSION; CRYSTAL STRUCTURE; DISSOLUTION; ELECTROLYTES; LEAD OXIDE; NUCLEATION; PALLADIUM; PHOTORESISTS; SULFURIC ACID; SURFACE ROUGHNESS; SURFACE STRUCTURE; TIN;

REPAIR;

EID: 77949676618     PISSN: 00134651     EISSN: None     Source Type: Journal    
DOI: 10.1149/1.3291985     Document Type: Article

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