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Electrochemical and Solid-State Letters

Volumn 5, Issue 4, 2002, Pages

Superconformal electrodeposition in vias

(3) Josell, D a Wheeler, D a Moffat, T P a

a NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER; CYCLIC VOLTAMMETRY; ELECTROLYTES; INTERFACES (MATERIALS); ORDINARY DIFFERENTIAL EQUATIONS; SEMICONDUCTOR DEVICES;

CURVATURE ENHANCED ACCELERATOR COVERAGE; DUAL DAMASCENE PROCESSING; SUPERCONFORMAL FILLING; VIAS;

ELECTRODEPOSITION;

EID: 0036534838 PISSN: 10990062 EISSN: None Source Type: Journal
DOI: 10.1149/1.1452485 Document Type: Article

Times cited : (47)

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