Investigation of PEG adsorption on copper in Cu 2+-free solution by SERS and AFM

Electrochimica Acta

Volumn 78, Issue , 2012, Pages 459-465

  Jin, Ying ^a   Sun, Ming ^a   Mu, Daobin ^b   Ren, Xuechong ^a   Wang, Qingmei ^a   Wen, Lei ^a  

^a UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING   (China)

^b BEIJING INSTITUTE OF TECHNOLOGY   (China)

Author keywords

AFM; Damascene copper plating; PEG; SERS; Surface adsorption

Indexed keywords

ADSORPTION AMOUNTS; AFM; DAMASCENE COPPER; DAMASCENE PLATING; EXTERNAL SURFACES; FREE ELECTROLYTES; FREE SOLUTIONS; IMMERSION TIME; IN-SITU; NEGATIVE POTENTIAL; POTENTIOSTATIC CONDITIONS; SERS; STEADY STATUS; SURFACE ADSORPTION; SURFACE ENHANCED RAMAN SPECTROSCOPY;

ADSORPTION; ATOMIC FORCE MICROSCOPY; COPPER PLATING; ELECTROLYTES; POLYETHYLENE GLYCOLS; RAMAN SPECTROSCOPY;

CHLORINE COMPOUNDS;

EID: 84864277318     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2012.06.039     Document Type: Article

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